Jankowski Dawid, Wiwatowski Kamil, Żebrowski Michał, Pilch-Wróbel Aleksandra, Bednarkiewicz Artur, Maćkowski Sebastian, Piątkowski Dawid
Institute of Physics, Faculty of Physics, Astronomy and Informatics, Nicolaus Copernicus University in Toruń, ul. Grudziądzka, 5, 87-100 Toruń, Poland.
Institute of Low Temperature and Structure Research, Polish Academy of Sciences, ul. Okólna, 2, 50-422 Wroclaw, Poland.
Nanomaterials (Basel). 2024 Dec 11;14(24):1985. doi: 10.3390/nano14241985.
In this work, we present an experimental approach for monitoring the temperature of submicrometric, real-time operating electrical circuits using luminescence thermometry. For this purpose, we utilized lanthanide-doped up-converting nanocrystals as nanoscale temperature probes, which, combined with a highly sensitive confocal photoluminescence microscope, enabled temperature monitoring with spatial resolution limited only by the diffraction of light. To validate our concept, we constructed a simple model of an electrical microcircuit based on a single silver nanowire with a diameter of approximately 100 nm and a length of about 50 µm, whose temperature increase was induced by electric current flow. By driving electric current only along one half of the nanowire, we created a dual-function microstructure, where one section is a resistive heater, while the other operates as a radiator. Such a combination realistically reflects the electronic circuit and its thermal behavior. We demonstrated that nanocrystals distributed around this circuit allow for remote temperature readout and enable precise monitoring of the thermal energy propagation and heat dissipation processes, which are crucial for designing and developing highly integrated electronic on-chip devices.
在这项工作中,我们展示了一种使用发光测温法监测亚微米级实时运行电路温度的实验方法。为此,我们利用掺杂镧系元素的上转换纳米晶体作为纳米级温度探针,其与高灵敏度共聚焦光致发光显微镜相结合,实现了空间分辨率仅受光衍射限制的温度监测。为了验证我们的概念,我们构建了一个基于单根银纳米线的简单微电路模型,该银纳米线直径约为100 nm,长度约为50 µm,电流通过时会导致其温度升高。通过仅沿纳米线的一半驱动电流,我们创建了一种双功能微结构,其中一部分是电阻加热器,而另一部分作为散热器。这种组合真实地反映了电子电路及其热行为。我们证明,分布在该电路周围的纳米晶体能够实现远程温度读数,并能够精确监测热能传播和散热过程,这对于设计和开发高度集成的片上电子器件至关重要。