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使用校准扫描热显微镜对电子设备进行纳米级温度传感。

Nanoscale temperature sensing of electronic devices with calibrated scanning thermal microscopy.

机构信息

Department of Thermal and Fluid Engineering, Faculty of Engineering Technology, University of Twente, Enschede, The Netherlands.

Faculty of Electrical Engineering, Technion - Israel Institute of Technology, Haifa, Israel.

出版信息

Nanoscale. 2023 Apr 13;15(15):7139-7146. doi: 10.1039/d3nr00343d.

DOI:10.1039/d3nr00343d
PMID:37006192
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10099078/
Abstract

Heat dissipation threatens the performance and lifetime of many electronic devices. As the size of devices shrinks to the nanoscale, we require spatially and thermally resolved thermometry to observe their fine thermal features. Scanning thermal microscopy (SThM) has proven to be a versatile measurement tool for characterizing the temperature at the surface of devices with nanoscale resolution. SThM can obtain qualitative thermal maps of a device using an operating principle based on a heat exchange process between a thermo-sensitive probe and the sample surface. However, the quantification of these thermal features is one of the most challenging parts of this technique. Developing reliable calibration approaches for SThM is therefore an essential aspect to accurately determine the temperature at the surface of a sample or device. In this work, we calibrate a thermo-resistive SThM probe using heater-thermometer metal lines with different widths (50 nm to 750 nm), which mimic variable probe-sample thermal exchange processes. The sensitivity of the SThM probe when scanning the metal lines is also evaluated under different probe and line temperatures. Our results reveal that the calibration factor depends on the probe measuring conditions and on the size of the surface heating features. This approach is validated by mapping the temperature profile of a phase change electronic device. Our analysis provides new insights on how to convert the thermo-resistive SThM probe signal to the scanned device temperature more accurately.

摘要

散热会威胁到许多电子设备的性能和寿命。随着器件尺寸缩小到纳米尺度,我们需要具有空间和热分辨率的测温技术来观察其细微的热特征。扫描热显微镜(SThM)已被证明是一种通用的测量工具,可用于以纳米级分辨率对器件表面的温度进行特性描述。SThM 可以使用基于热敏探头与样品表面之间热交换过程的工作原理来获得器件的定性热图。然而,对这些热特征进行定量是该技术最具挑战性的部分之一。因此,开发可靠的 SThM 校准方法是准确确定样品或器件表面温度的重要方面。在这项工作中,我们使用具有不同宽度(50nm 至 750nm)的加热器-温度计金属线对热阻 SThM 探头进行校准,这些金属线模拟了可变的探头-样品热交换过程。还评估了在不同探头和线温度下,SThM 探头在扫描金属线时的灵敏度。我们的结果表明,校准因子取决于探头的测量条件和表面加热特征的大小。通过对相变电子设备的温度分布进行映射,验证了这种方法的有效性。我们的分析提供了有关如何更准确地将热阻 SThM 探头信号转换为扫描器件温度的新见解。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/6592548ee253/d3nr00343d-f4.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/b07df2ff5541/d3nr00343d-f1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/362dd4910a3b/d3nr00343d-f2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/3d7c23892bd0/d3nr00343d-f3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/6592548ee253/d3nr00343d-f4.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/b07df2ff5541/d3nr00343d-f1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/362dd4910a3b/d3nr00343d-f2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/3d7c23892bd0/d3nr00343d-f3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b9a/10099078/6592548ee253/d3nr00343d-f4.jpg

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