铅管和铅锡焊料水垢的形成与结构：一个概念模型。
Lead pipe and lead-tin solder scale formation and structure: A conceptual model.
作者信息
Snoeyink Vernon L, Tang Min, Lytle Darren A
机构信息
Department of Civil and Environmental Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, USA.
ORISE Postdoctoral Fellow at U.S. Environmental Protection Agency, ORD, CESER, WID, DWMB, Cincinnati, Ohio, USA.
出版信息
AWWA Water Sci. 2021 Sep 24;3(5). doi: 10.1002/aws2.1246.
Lead-tin solder and lead service lines (LSLs) are important sources of lead, and after LSLs are removed, lead-tin solder will remain a major source of lead. A better understanding of the factors that control lead release from solder joints can help water utilities reduce lead. This paper reviews the reactions that take place at galvanic connections involving both lead-tin solder and lead pipe in contact with copper. A conceptual model based on these reactions was developed and is presented here to explain how such scale structure forms. The likely reactions that affect lead release for each of three cases, (1) no galvanic action, (2) lead anode and copper-brass cathode, and (3) lead cathode and copper-brass anode, are presented. The model also considers uniform corrosion that takes place on LSLs. This model should be useful when evaluating the impact of water quality changes on lead release from galvanic connections and LSLs.
铅锡焊料和铅质供水管线是铅的重要来源，在移除铅质供水管线后，铅锡焊料仍将是铅的主要来源。更好地了解控制焊点中铅释放的因素有助于供水企业减少铅污染。本文综述了在涉及铅锡焊料和与铜接触的铅管的电偶连接中发生的反应。基于这些反应开发了一个概念模型，并在此展示以解释这种垢层结构是如何形成的。文中给出了三种情况下（1）无电偶作用、（2）铅作阳极和铜 - 黄铜作阴极、（3）铅作阴极和铜 - 黄铜作阳极）可能影响铅释放的反应。该模型还考虑了铅质供水管线上发生的均匀腐蚀。在评估水质变化对电偶连接和铅质供水管线中铅释放的影响时，此模型应会有所帮助。
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