Enmark Markus, Murugesan Murali, Zhang Hongfeng, Nilsson Torbjörn M J, Kallio Kai J, Kamal Arian, Liu Johan
Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, Kemivägen 9, SE-412 96 Göteborg, Sweden.
SHT Smart High-Tech AB, Arendals Allé 3, SE-418 79 Göteborg, Sweden.
Nanotechnology. 2025 Jan 6;36(10). doi: 10.1088/1361-6528/ad9f6d.
The trend towards miniaturization of electronics and increasing transistor density in semiconductors requires more efficient cooling solutions. Vapor chambers are well established passive cooling devices that are used in a wide variety of electronics. Commercial vapor chambers are often made of high-density metals such as copper which can be a downside in lightweight applications such as laptops, smartphones, and tablets. In this study, different novel lightweight graphene-enhanced vapor chambers were built using graphene-assembled film with high thermal conductivity as envelope material. The thermal performance of the designed graphene-enhanced vapor chambers was characterized in a customized test rig and compared to a copper vapor chamber. One of the graphene-enhanced vapor chambers was shown to have 21.6% lower thermal resistance than that of a copper vapor chamber with the same design. A mass-based thermal resistance parameter was introduced as a figure of merit to account for the superior low density of the graphene-enhanced vapor chambers. The mass-based thermal resistance of the graphene-enhanced vapor chamber was seen to be 46.5% lower than that of the copper vapor chamber. The result of this study shows that replacing copper with graphene-assembled film as envelope in vapor chambers can both reduce thermal resistance and decrease the mass of the device. Hence, it is believed that graphene-enhanced vapor chambers have great potential for replacing conventional metal-based vapor chambers in lightweight and high-performance electronics and power module cooling applications in the future.
电子设备小型化以及半导体中晶体管密度不断增加的趋势，需要更高效的散热解决方案。汽相室是成熟的被动散热装置，广泛应用于各种电子产品中。商用汽相室通常由铜等高密度金属制成，这在笔记本电脑、智能手机和平板电脑等轻量级应用中可能是一个缺点。在本研究中，使用具有高导热性的石墨烯组装薄膜作为外壳材料，构建了不同的新型轻质石墨烯增强汽相室。在定制的试验台上对设计的石墨烯增强汽相室的热性能进行了表征，并与铜汽相室进行了比较。结果表明，其中一个石墨烯增强汽相室的热阻比相同设计的铜汽相室低21.6%。引入了基于质量的热阻参数作为品质因数，以考虑石墨烯增强汽相室的低密度优势。石墨烯增强汽相室的基于质量的热阻比铜汽相室低46.5%。本研究结果表明，在汽相室中用石墨烯组装薄膜取代铜作为外壳，既能降低热阻，又能减轻设备质量。因此，人们认为石墨烯增强汽相室在未来的轻量级和高性能电子产品以及功率模块散热应用中，具有取代传统金属基汽相室的巨大潜力。
