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热老化过程中环氧树脂/硅片复合材料界面残余应力分析

Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging.

作者信息

Wu Jianyu, Chen Fangzhou, Liu Jiahao, Chen Rui, Liu Peijiang, Zhao Hao, Zhao Zhenbo

机构信息

Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511370, China.

出版信息

Polymers (Basel). 2024 Dec 28;17(1):50. doi: 10.3390/polym17010050.

DOI:10.3390/polym17010050
PMID:39795451
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11723281/
Abstract

During the thermal aging process of epoxy resin, microcracks, interfacial delamination, and warpage are the key factors leading to semiconductor device damage. Here, epoxy-resin specimens (EP-Ss) and epoxy-resin/silicon-wafer composites (EP-SWs) were prepared to analyze the distribution of residual stress (RS) in epoxy resin and its thermal aging process changes. The uniaxial tensile approach and Raman spectroscopy (RAS) showed that the peak shift of aliphatic C-O in EP-Ss was negatively correlated with the external stress, and that the stress correlation coefficient was -2.76 × 10 cm/MPa. Then, RAS was used to evaluate the RS distribution of EP-SWs, obtaining a high-resolution stress-distribution image of 50 × 50 pixels and revealing a strong stress concentration at the interface between the epoxy resin and the silicon wafer. Additionally, Fourier transform infrared spectroscopy (FTIR), Differential scanning calorimetry (DSC), Field-emission scanning electron microscopy (FE-SEM), and RAS were used to analyze the chemical composition, molecular structure, interfacial microstructure, and RS of the epoxy resin during the thermal aging process. With the increase in the thermal aging time, the epoxy resin underwent secondary curing, the RS at the interface changed from tensile stress to compressive stress, and cracks were formed. The results illuminate the effect of the thermal aging process on the interface-failure mechanism of composite materials, aiding in the reliability evaluation and safety design of semiconductor devices.

摘要

在环氧树脂的热老化过程中，微裂纹、界面分层和翘曲是导致半导体器件损坏的关键因素。在此，制备了环氧树脂试样（EP-Ss）和环氧树脂/硅片复合材料（EP-SWs），以分析环氧树脂中残余应力（RS）的分布及其在热老化过程中的变化。单轴拉伸方法和拉曼光谱（RAS）表明，EP-Ss中脂肪族C-O的峰位移与外部应力呈负相关，应力相关系数为-2.76×10 cm/MPa。然后，利用RAS评估EP-SWs的RS分布，获得了50×50像素的高分辨率应力分布图像，并揭示了环氧树脂与硅片界面处的强烈应力集中。此外，还利用傅里叶变换红外光谱（FTIR）、差示扫描量热法（DSC）、场发射扫描电子显微镜（FE-SEM）和RAS分析了热老化过程中环氧树脂的化学成分、分子结构、界面微观结构和RS。随着热老化时间的增加，环氧树脂发生二次固化，界面处的RS从拉伸应力变为压缩应力，并形成裂纹。这些结果阐明了热老化过程对复合材料界面失效机制的影响，有助于半导体器件的可靠性评估和安全设计。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/dae3a5c908bd/polymers-17-00050-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/eb7a1cb6ecbb/polymers-17-00050-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/ebf4b9adb781/polymers-17-00050-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/5d12f7467515/polymers-17-00050-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/0503206b462f/polymers-17-00050-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/6f438bc50fdc/polymers-17-00050-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/0cace6bb458d/polymers-17-00050-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/6e9279f32343/polymers-17-00050-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/764e88f943a8/polymers-17-00050-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/fbf3bb47411c/polymers-17-00050-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/dae3a5c908bd/polymers-17-00050-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/eb7a1cb6ecbb/polymers-17-00050-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/ebf4b9adb781/polymers-17-00050-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/5d12f7467515/polymers-17-00050-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/0503206b462f/polymers-17-00050-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/6f438bc50fdc/polymers-17-00050-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/0cace6bb458d/polymers-17-00050-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/6e9279f32343/polymers-17-00050-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/764e88f943a8/polymers-17-00050-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/fbf3bb47411c/polymers-17-00050-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec51/11723281/dae3a5c908bd/polymers-17-00050-g010.jpg

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