Xu Wenjun, Cui Jiarong, Ma Yao, Hu Zhanpeng, Qi Yuyang, Li Xinying, Zhong Yuchen, Luo Tao, Chu Xuyang, Wu Linjing, Ling Weisong, Zhou Wei
Pen-Tung Sah Institute of Micro-Nano Science and Technology, Xiamen University, Xiamen, China.
State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR, China.
Nat Commun. 2025 Feb 17;16(1):1713. doi: 10.1038/s41467-025-56960-1.
Thermal management using a vapor-liquid two-phase circulation system is challenging in compact and complex-shaped electronic devices. In this study, we design and fabricate a heat pipe that can adapt to various shapes, regardless of space constraints. The heat pipe is capable of bending or twisting in three dimensions, making it suitable for electronic devices of arbitrary shapes. It effectively transfers heat from in-plane chips to out-of-plane spaces through flexible circulation pathways. This two-phase heat cycle system achieves an ultra-high thermal conductivity of up to 11,363 W/m·K. The flexible and adaptive design strategy enables efficient heat transfer in complex and compact environments.
在紧凑且形状复杂的电子设备中，使用气液两相循环系统进行热管理具有挑战性。在本研究中，我们设计并制造了一种热管，它能够适应各种形状，不受空间限制。该热管能够在三维空间中弯曲或扭曲，使其适用于任意形状的电子设备。它通过灵活的循环路径有效地将热量从平面内的芯片传递到平面外的空间。这种两相热循环系统实现了高达11363W/m·K的超高热导率。这种灵活且自适应的设计策略能够在复杂紧凑的环境中实现高效的热传递。
