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利用铟和钴的铁磁范德华接触在石墨烯中进行自旋注入。

Spin injection in graphene using ferromagnetic van der Waals contacts of indium and cobalt.

作者信息

Sarkar Soumya, Oh Saeyoung, Newton Peter J, Li Yang, Zhu Yiru, Ghani Maheera Abdul, Yan Han, Jeong Hu Young, Wang Yan, Chhowalla Manish

机构信息

Department of Materials Science & Metallurgy, University of Cambridge, Cambridge, UK.

Graduate School of Semiconductor Materials and Devices Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan, Republic of Korea.

出版信息

Nat Electron. 2025;8(3):215-221. doi: 10.1038/s41928-024-01330-w. Epub 2025 Jan 20.

DOI:10.1038/s41928-024-01330-w
PMID:40162043
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11949831/
Abstract

Graphene-based spintronic devices require efficient spin injection, and dielectric tunnel barriers are typically used to facilitate spin injection. However, the direct growth of ultrathin dielectrics on two-dimensional surfaces is challenging and unreliable. Here we report spin injection in graphene lateral spin valves using ferromagnetic van der Waals contacts of indium and cobalt (In-Co), and without the deposition of dielectric tunnel barriers. With this approach, we obtain magnetoresistance values of 1.5% ± 0.5% (spin signal around 50 Ω), which is comparable to state-of-the-art graphene lateral spin valves with oxide tunnel barriers, with a working device yield of more than 70%. By contrast, lateral spin valves with non-van der Waals contacts containing only cobalt are inefficient and exhibit, at best, a magnetoresistance of around 0.2% (spin signal around 3 Ω). The contact resistance of our ferromagnetic indium-cobalt van der Waals contacts is 2-5 kΩ, which makes them compatible with complementary metal-oxide-semiconductor devices.

摘要

基于石墨烯的自旋电子器件需要高效的自旋注入,通常使用介电隧道势垒来促进自旋注入。然而,在二维表面上直接生长超薄电介质具有挑战性且不可靠。在此,我们报道了在石墨烯横向自旋阀中使用铟和钴(In-Co)的铁磁范德华接触进行自旋注入,且无需沉积介电隧道势垒。通过这种方法,我们获得了1.5%±0.5%的磁电阻值(自旋信号约为50Ω),这与具有氧化物隧道势垒的先进石墨烯横向自旋阀相当,工作器件成品率超过70%。相比之下,仅含钴的非范德华接触的横向自旋阀效率低下,磁电阻最高约为0.2%(自旋信号约为3Ω)。我们的铁磁铟 - 钴范德华接触的接触电阻为2 - 5kΩ,这使其能够与互补金属氧化物半导体器件兼容。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/b7cf80549351/41928_2024_1330_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/776cf24a4abf/41928_2024_1330_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/5a920314b72e/41928_2024_1330_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/398cb7b8b542/41928_2024_1330_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/b7cf80549351/41928_2024_1330_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/776cf24a4abf/41928_2024_1330_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/5a920314b72e/41928_2024_1330_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/398cb7b8b542/41928_2024_1330_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/442d/11949831/b7cf80549351/41928_2024_1330_Fig4_HTML.jpg

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