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三维金属与二维半导体之间的范德华接触。

Van der Waals contacts between three-dimensional metals and two-dimensional semiconductors.

作者信息

Wang Yan, Kim Jong Chan, Wu Ryan J, Martinez Jenny, Song Xiuju, Yang Jieun, Zhao Fang, Mkhoyan Andre, Jeong Hu Young, Chhowalla Manish

机构信息

Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UK.

Materials Science and Engineering, Rutgers University, Piscataway, NJ, USA.

出版信息

Nature. 2019 Apr;568(7750):70-74. doi: 10.1038/s41586-019-1052-3. Epub 2019 Mar 27.

Abstract

As the dimensions of the semiconducting channels in field-effect transistors decrease, the contact resistance of the metal-semiconductor interface at the source and drain electrodes increases, dominating the performance of devices. Two-dimensional (2D) transition-metal dichalcogenides such as molybdenum disulfide (MoS) have been demonstrated to be excellent semiconductors for ultrathin field-effect transistors. However, unusually high contact resistance has been observed across the interface between the metal and the 2D transition-metal dichalcogenide. Recent studies have shown that van der Waals contacts formed by transferred graphene and metals on few-layered transition-metal dichalcogenides produce good contact properties. However, van der Waals contacts between a three-dimensional metal and a monolayer 2D transition-metal dichalcogenide have yet to be demonstrated. Here we report the realization of ultraclean van der Waals contacts between 10-nanometre-thick indium metal capped with 100-nanometre-thick gold electrodes and monolayer MoS. Using scanning transmission electron microscopy imaging, we show that the indium and gold layers form a solid solution after annealing at 200 degrees Celsius and that the interface between the gold-capped indium and the MoS is atomically sharp with no detectable chemical interaction between the metal and the 2D transition-metal dichalcogenide, suggesting van-der-Waals-type bonding between the gold-capped indium and monolayer MoS. The contact resistance of the indium/gold electrodes is 3,000 ± 300 ohm micrometres for monolayer MoS and 800 ± 200 ohm micrometres for few-layered MoS. These values are among the lowest observed for three-dimensional metal electrodes evaporated onto MoS, enabling high-performance field-effect transistors with a mobility of 167 ± 20 square centimetres per volt per second. We also demonstrate a low contact resistance of 220 ± 50 ohm micrometres on ultrathin niobium disulfide (NbS) and near-ideal band offsets, indicative of defect-free interfaces, in tungsten disulfide (WS) and tungsten diselenide (WSe) contacted with indium alloy. Our work provides a simple method of making ultraclean van der Waals contacts using standard laboratory technology on monolayer 2D semiconductors.

摘要

随着场效应晶体管中半导体沟道尺寸的减小,源极和漏极处金属 - 半导体界面的接触电阻增加,这主导了器件的性能。二维(2D)过渡金属二硫属化物,如二硫化钼(MoS),已被证明是用于超薄场效应晶体管的优异半导体。然而,在金属与二维过渡金属二硫属化物之间的界面上观察到了异常高的接触电阻。最近的研究表明,通过在少层过渡金属二硫属化物上转移石墨烯和金属形成的范德华接触具有良好的接触性能。然而,三维金属与单层二维过渡金属二硫属化物之间的范德华接触尚未得到证实。在此,我们报告了在覆盖有100纳米厚金电极的10纳米厚铟金属与单层MoS之间实现超清洁范德华接触。通过扫描透射电子显微镜成像,我们表明铟层和金层在200摄氏度退火后形成固溶体,并且金覆盖的铟与MoS之间的界面在原子尺度上是尖锐的,金属与二维过渡金属二硫属化物之间没有可检测到的化学相互作用,这表明金覆盖的铟与单层MoS之间存在范德华型键合。对于单层MoS,铟/金电极的接触电阻为3000±300欧姆·微米,对于少层MoS为800±200欧姆·微米。这些值是在蒸发到MoS上的三维金属电极中观察到的最低值之一,使得能够制造出迁移率为167±20平方厘米每伏每秒的高性能场效应晶体管。我们还展示了在超薄二硫化铌(NbS)上220±50欧姆·微米的低接触电阻,以及在与铟合金接触的二硫化钨(WS)和二硒化钨(WSe)中接近理想的能带偏移,这表明界面无缺陷。我们的工作提供了一种使用标准实验室技术在单层二维半导体上制造超清洁范德华接触的简单方法。

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