Yang Pengfei, Wen Xiaolong, Li Xiaonan, Chu Zhaozhi, Peng Chunrong, Wu Shuang
Beijing Key Laboratory for Sensors, School of Applied Science, Beijing Information Science and Technology University, Beijing 100192, China.
School of Mathematics and Physics, University of Science and Technology Beijing, Beijing 100083, China.
Micromachines (Basel). 2025 Apr 20;16(4):484. doi: 10.3390/mi16040484.
This study presents a 3D DC electric field meter (EFM) that uses three identical 1D MEMS chips. The shielding electrodes and sensing electrodes of the MEMS chips employ a combination of rigid frames and short strip-type beams to improve vibrational stability. To enhance sensitivity, our MEMS chips feature inner convex packaging covers. Moreover, the integrated design and wireless transmission efficiently eradicate the impact of ground potential on detection results. Detailed simulations have been conducted to analyze the electric field distribution within the chip package and the electric field distribution on the EFM's surface. A prototype was then developed, calibrated, and validated. The test results indicate that the sensitivity of our proposed 3D EFM is at least 4.64 times higher than the highest sensitivity observed in previously reported MEMS 3D EFMs. The maximum relative deviation is a mere 2.2% for any rotation attitude. Remarkably, even in high humidity conditions, the EFM's linearity remains within 1%. Additionally, the resolution of any single axis is less than 10 V/m.
本研究提出了一种使用三个相同的一维微机电系统（MEMS）芯片的三维直流电场计（EFM）。MEMS芯片的屏蔽电极和传感电极采用刚性框架和短条形梁的组合，以提高振动稳定性。为了提高灵敏度，我们的MEMS芯片具有内部凸起的封装盖。此外，集成设计和无线传输有效地消除了地电位对检测结果的影响。已经进行了详细的模拟，以分析芯片封装内的电场分布和EFM表面的电场分布。然后开发了一个原型，进行了校准和验证。测试结果表明，我们提出的三维EFM的灵敏度比先前报道的MEMS三维EFM中观察到的最高灵敏度至少高4.64倍。对于任何旋转姿态，最大相对偏差仅为2.2%。值得注意的是，即使在高湿度条件下，EFM的线性度仍保持在1%以内。此外，任何单轴的分辨率均小于10 V/m。
