Avvaru Venkata Sai, Ogunfunmi Tofunmi, Jeong Seonghun, Diallo Mouhamad Said, Watt John, Scott Mary C, Kim Haegyeom
Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States.
Department of Materials Science and Engineering, University of California, Berkeley, California 94720, United States.
ACS Nano. 2025 May 13;19(18):17347-17356. doi: 10.1021/acsnano.4c16271. Epub 2025 Apr 29.
All-solid-state lithium-metal batteries hold great promise because of their high energy density stemming from using an energy-dense lithium-metal anode. However, mitigating the dendritic lithium-metal growth, originating from heterogeneous lithium-metal deposition, is a priority to suppress short-circuit and extend cycle life. This study employs direct current (DC) magnetron sputter coating to deposit tin (Sn) and carbon (C) on a stainless steel (SUS) current collector to achieve uniform lithium-metal plating and improve cycling performance. In particular, we evaluated and compared two dual buffer layer designs, consisting of Sn and C: (1) a thin C layer is deposited on the Sn metal layer (SUS/Sn/C), and (2) the Sn metal layer is deposited on the thin C layer (SUS/C/Sn). This study demonstrated that the SUS/Sn/C buffer layer is more effective in suppressing lithium dendrite growth and improving cycling stability than the SUS/C/Sn buffer layer. The SUS/Sn/C buffer layer shows stable Li-plating/stripping cycling over 450 cycles without noticeable short-circuit. and characterization confirm the role of the SUS/Sn/C dual buffer layer: (i) the Sn metals result in a uniform lithium-metal deposition on the current collector and (ii) the carbon layer acts as a physical barrier to suppress the lithium dendrite growth toward the solid electrolyte because of its lithiophobic nature.
全固态锂金属电池因其使用能量密度高的锂金属阳极而具有很高的能量密度,因而前景广阔。然而,减轻由不均匀锂金属沉积引发的枝晶状锂金属生长,是抑制短路和延长循环寿命的首要任务。本研究采用直流磁控溅射镀膜法在不锈钢集流体上沉积锡(Sn)和碳(C),以实现均匀的锂金属电镀并改善循环性能。具体而言,我们评估并比较了由Sn和C组成的两种双缓冲层设计:(1)在Sn金属层上沉积一层薄C层(SUS/Sn/C),以及(2)在薄C层上沉积Sn金属层(SUS/C/Sn)。本研究表明,SUS/Sn/C缓冲层在抑制锂枝晶生长和提高循环稳定性方面比SUS/C/Sn缓冲层更有效。SUS/Sn/C缓冲层在450次循环中显示出稳定的锂电镀/剥离循环,没有明显的短路现象。 和 表征证实了SUS/Sn/C双缓冲层的作用:(i)Sn金属使锂金属在集流体上均匀沉积,以及(ii)碳层因其疏锂性质而起到物理屏障的作用,抑制锂枝晶向固体电解质生长。