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通过随机互连的金纳米颗粒与黑硅的原位集成将光电探测推向超越硅PIN结的极限

Pushing Photodetection Beyond the Limit of Silicon PIN Junctions Through In Situ Integration of Randomly Interlinked Gold Nanoparticles and Black Silicon.

作者信息

Mi Guanyu, Nie Changbin, Fu Jintao, Liu Jun, Wei Xingzhan, Tan Cheng, Que Longcheng, Sun Weiyi, An Zeyu, Huang Jian, Liu Zhongyuan, Lv Jian

机构信息

State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China.

Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences, Chongqing 400714, China.

出版信息

ACS Appl Mater Interfaces. 2025 Jun 18;17(24):35743-35750. doi: 10.1021/acsami.5c05045. Epub 2025 Jun 4.

Abstract

High-responsivity and broad-spectrum photodetectors are indispensable for advanced photoelectric applications. While silicon PIN junctions offer several advantages, such as mature manufacturing processes, stable performance, and cost-effectiveness, their near-infrared detection capabilities are fundamentally constrained by the intrinsic properties of silicon. In this study, we propose a device structure that advances photodetection beyond the limitation of silicon PIN junctions by in situ integrating randomly interlinked gold nanoparticles and black silicon (RIL-AuNPs/B-Si). The localized surface plasmon resonance effect (LSPR) of the gold nanoparticles induces strongly coupled and enhanced electric fields on the black silicon surface, significantly improving light absorption and boosting device responsivity. Furthermore, when exposed to photons with energies below the silicon bandgap, hot electrons generated within the gold nanoparticles are efficiently transferred into the black silicon, extending the spectral response range. Experimental results reveal that the RIL-AuNPs/B-Si PD achieves a responsivity of 0.62 A/W at 1064 nm, while also maintaining responsivities of 42.8 mA/W at 1310 nm and 23.8 mA/W at 1550 nm, where conventional planar silicon PDs exhibit no photoelectric response. This work not only establishes RIL-AuNPs/B-Si PDs as high-performance broadband photodetectors but also provides a promising strategy for designing next-generation optoelectronic devices.

摘要

高响应度和宽光谱光电探测器对于先进的光电应用不可或缺。虽然硅PIN结具有一些优点,如成熟的制造工艺、稳定的性能和成本效益,但它们的近红外探测能力从根本上受到硅固有特性的限制。在本研究中,我们提出了一种器件结构,通过原位集成随机互连的金纳米颗粒和黑硅(RIL-AuNPs/B-Si),突破硅PIN结的限制,推进光电探测。金纳米颗粒的局域表面等离子体共振效应(LSPR)在黑硅表面诱导出强耦合和增强的电场,显著提高光吸收并提升器件响应度。此外,当暴露于能量低于硅带隙的光子时,金纳米颗粒内产生的热电子被有效地转移到黑硅中,扩展了光谱响应范围。实验结果表明,RIL-AuNPs/B-Si光电探测器在1064nm处的响应度达到0.62A/W,同时在1310nm处保持42.8mA/W的响应度,在1550nm处保持23.8mA/W的响应度,而传统的平面硅光电探测器在此处没有光电响应。这项工作不仅将RIL-AuNPs/B-Si光电探测器确立为高性能宽带光电探测器,还为设计下一代光电器件提供了一种有前景的策略。

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