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银和熔体过冷对锡银焊球微观结构的影响。

Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.

作者信息

Sun Sihan, Li Ao, Cheng Chao, Gourlay Christopher M

机构信息

Department of Materials, Imperial College London, London, SW7 2AZ UK.

出版信息

J Mater Sci Mater Electron. 2025;36(16):942. doi: 10.1007/s10854-025-14979-6. Epub 2025 Jun 2.

DOI:10.1007/s10854-025-14979-6
PMID:40470271
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12130131/
Abstract

UNLABELLED

The microstructure of electronic solder joints is created by solidification in an undercooled melt. Here, we apply the framework of solidification microstructure selection maps (SMSMs) to Sn-Ag solder balls with compositions from 0.5 to 5.0 wt.% Ag and bulk undercoolings in the range 10-70 K. The effects of Ag and melt undercooling on the transition from single-grain to cyclic-twinned microstructures and the extent of interlacing are revealed. Controlled by the Ag content and the competitive nucleation between the β-Sn and AgSn phases, a competition between tin dendrite and eutectic growth is observed that decides the microstructure of solder balls. The solidification microstructure selection map, modified to account for whether AgSn or β-Sn nucleate first in competitive nucleation, is in reasonable agreement with coupled zone theory. The map provides a guide for tailoring desired solder microstructures for mechanical performance through controlling the nucleation undercooling of β-Sn and AgSn during solidification.

SUPPLEMENTARY INFORMATION

The online version contains supplementary material available at 10.1007/s10854-025-14979-6.

摘要

未标注

电子焊点的微观结构是由过冷熔体中的凝固过程形成的。在此，我们将凝固微观结构选择图（SMSMs）框架应用于银含量为0.5至5.0 wt.%且体过冷度在10 - 70 K范围内的锡银焊球。揭示了银和熔体过冷对从单晶粒到循环孪晶微观结构转变以及交错程度的影响。受银含量以及β - 锡和AgSn相之间竞争形核的控制，观察到锡枝晶与共晶生长之间的竞争，这决定了焊球的微观结构。经修改以考虑在竞争形核中AgSn或β - 锡哪个先形核的凝固微观结构选择图，与耦合区理论合理吻合。该图为通过控制凝固过程中β - 锡和AgSn的形核过冷度来定制具有所需机械性能的焊料微观结构提供了指导。

补充信息

在线版本包含可在10.1007/s10854 - 025 - 14979 - 6获取的补充材料。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/7d0d2c1cac77/10854_2025_14979_Fig11_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/95810792453c/10854_2025_14979_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/4ee80d99b64b/10854_2025_14979_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/f567cffec5eb/10854_2025_14979_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/2a772cd46a82/10854_2025_14979_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/f850ab91686c/10854_2025_14979_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/e1753f334136/10854_2025_14979_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/10cf40c0992d/10854_2025_14979_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/08b864bfe97c/10854_2025_14979_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/55c8971c75db/10854_2025_14979_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/70ff5de861bc/10854_2025_14979_Fig10_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/7d0d2c1cac77/10854_2025_14979_Fig11_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/95810792453c/10854_2025_14979_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/4ee80d99b64b/10854_2025_14979_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/f567cffec5eb/10854_2025_14979_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/2a772cd46a82/10854_2025_14979_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/f850ab91686c/10854_2025_14979_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/e1753f334136/10854_2025_14979_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/10cf40c0992d/10854_2025_14979_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/08b864bfe97c/10854_2025_14979_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/55c8971c75db/10854_2025_14979_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/70ff5de861bc/10854_2025_14979_Fig10_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6830/12130131/7d0d2c1cac77/10854_2025_14979_Fig11_HTML.jpg

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本文引用的文献

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The role of microstructure in the thermal fatigue of solder joints.
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Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections.利用异质成核控制电子互连中的锡取向。
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In situ click chemistry generation of cyclooxygenase-2 inhibitors.原位点击化学法生成环氧合酶-2抑制剂
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