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The role of microstructure in the thermal fatigue of solder joints.

作者信息

Xian J W, Xu Y L, Stoyanov S, Coyle R J, Dunne F P E, Gourlay C M

机构信息

Department of Materials, Imperial College London, London, UK.

School of Materials Science and Engineering, Dalian University of Technology, Dalian, China.

出版信息

Nat Commun. 2024 May 20;15(1):4258. doi: 10.1038/s41467-024-48532-6.

DOI:10.1038/s41467-024-48532-6
PMID:38769155
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11106336/
Abstract

Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened AgSn. We then interpret the results with a multi-scale modelling approach that links from a continuum model at the package/board scale through to a crystal plasticity finite element model at the microstructure scale. We measure and explain the dependence of damage evolution on (i) the β-Sn crystal orientation(s) in single and multigrain joints, and (ii) the coefficient of thermal expansion (CTE) mismatch between tin grains in cyclic twinned multigrain joints. We further explore the relative importance of the solder microstructure versus the joint location in the array. The results provide a basis for designing optimum solder joint microstructures for thermal fatigue resistance.

摘要
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/2f8a4395d0c7/41467_2024_48532_Fig10_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/557a9e9bef5b/41467_2024_48532_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/953d7e7e40f8/41467_2024_48532_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/b1a9db7ad1a4/41467_2024_48532_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/81b983cc1b2d/41467_2024_48532_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/5e7149c1ba27/41467_2024_48532_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/b0f4bd231c0f/41467_2024_48532_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/4c098911c70f/41467_2024_48532_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/fb3f616b55d8/41467_2024_48532_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/12bcf53d82b5/41467_2024_48532_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/2f8a4395d0c7/41467_2024_48532_Fig10_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/557a9e9bef5b/41467_2024_48532_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/953d7e7e40f8/41467_2024_48532_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/b1a9db7ad1a4/41467_2024_48532_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/81b983cc1b2d/41467_2024_48532_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/5e7149c1ba27/41467_2024_48532_Fig5_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/b0f4bd231c0f/41467_2024_48532_Fig6_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/4c098911c70f/41467_2024_48532_Fig7_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/fb3f616b55d8/41467_2024_48532_Fig8_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/12bcf53d82b5/41467_2024_48532_Fig9_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6315/11106336/2f8a4395d0c7/41467_2024_48532_Fig10_HTML.jpg

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引用本文的文献

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本文引用的文献

1
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Materials (Basel). 2022 Jul 21;15(14):5086. doi: 10.3390/ma15145086.
2
Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections.利用异质成核控制电子互连中的锡取向。
Nat Commun. 2017 Dec 4;8(1):1916. doi: 10.1038/s41467-017-01727-6.