Cai Jinwen, Jiang Qiaoling, Feng Keqin, Zhou Hongling
School of Mechanical Engineering, Sichuan University, Chengdu 610065, China.
College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China.
Materials (Basel). 2025 May 28;18(11):2539. doi: 10.3390/ma18112539.
W-Mo-Cu composites show promise for advanced applications, but their properties require optimization. In this study, a novel approach utilizing Cu-coated graphene (Cu@Gr) reinforcement with skeleton relative density adjustment was employed to tailor the microstructure and properties of W-Mo-Cu composites fabricated via infiltration sintering (1300 °C, 1.5 h). The results revealed that Cu@Gr significantly promoted sintering densification, modified the phase composition, and enhanced the properties of the composite. Specifically, the addition of 0.4 wt.% Cu@Gr resulted in a relative density of 98% for the composite, representing an 8% increase compared to the material without Cu@Gr. Furthermore, when higher amounts of Cu@Gr were incorporated, the composite consistently exhibited a high degree of densification. In addition to the primary W, Mo, and Cu phases, molybdenum carbide, MoC, was formed at 0.4 wt.% Cu@Gr, with its content rising proportionally to graphene dosage. Notably, the composite containing 0.6 wt.% Cu@Gr exhibits the highest thermal conductivity and electrical conductivity, showing 64% and 73% increases, respectively, versus Cu@Gr-free samples. Additionally, although W-Mo green compact density variations (73-85%) did not compromise graphene-induced densification, a higher green compact density reduced the thermal/electrical conductivities but increased the hardness. These findings demonstrate that controlled Cu@Gr incorporation and green compact optimization synergistically improve the properties of W-Mo-Cu composites, providing insights into high-performance material design.
钨-钼-铜复合材料在先进应用方面展现出潜力，但其性能需要优化。在本研究中，采用了一种利用铜包覆石墨烯（Cu@Gr）增强体并调整骨架相对密度的新方法，来定制通过浸渗烧结（1300℃，1.5小时）制备的钨-钼-铜复合材料的微观结构和性能。结果表明，Cu@Gr显著促进了烧结致密化，改变了相组成，并提高了复合材料的性能。具体而言，添加0.4 wt.%的Cu@Gr使复合材料的相对密度达到98%，与不含Cu@Gr的材料相比提高了8%。此外，当加入更多量的Cu@Gr时，复合材料始终表现出高度致密化。除了主要的钨、钼和铜相外，在添加0.4 wt.% Cu@Gr时形成了碳化钼（MoC），其含量与石墨烯用量成比例增加。值得注意的是，含有0.6 wt.% Cu@Gr的复合材料表现出最高的热导率和电导率，与不含Cu@Gr的样品相比，分别提高了64%和73%。此外，尽管钨-钼生坯密度变化（73 - 85%）并未影响石墨烯诱导的致密化，但较高的生坯密度降低了热导率/电导率，但提高了硬度。这些发现表明，控制Cu@Gr的加入和生坯优化可协同改善钨-钼-铜复合材料的性能，为高性能材料设计提供了见解。
