Chen Boya, Wu Shiyun, Zhang Ying, Yang Ming, Zhou Chunliang, Zhou Yumei
Shanghai Institute of Technology, Shanghai, 201418, China.
Northeast Institute of Geography and Agroecology, Chinese Academy of Sciences, Changchun, 130102, China.
Biometals. 2025 Jun 16. doi: 10.1007/s10534-025-00707-4.
Coating high concentrations of copper (Cu) on the inner wall of containers prevents root entanglement by inhibiting root tip elongation. However, it remains uncertain whether roots near and far from the container wall differentially absorb Cu, thereby triggering varied defense responses. Two-year-old Camphora officinarum were planted in containers coated with 120 (T1) and 200 (T2) g L Cu(OH) with latex as the carrier. After six months of treatment, obvious root entanglement in containers only coated with latex (T0) and control containers was observed, while no entanglement in T1 and T2. Cu(OH) treatment increased soil and root Cu concentration, which exhibited significant position differences (near-wall vs. far-wall) in T1 and T2. Root Cu concentration near the container wall in T1 and T2 was 3.5 and 3.0 times higher than that far from the container wall, and 19.3 and 32.1 times higher than that in the control. Oxidative stress biomarkers increased with increasing root Cu concentration with the highest levels near the container wall in T2. Excessive Cu increased antioxidant enzyme activities and non-enzymatic antioxidant contents with higher superoxide dismutase, glutathione reductase, glutathione peroxidase, ascorbate peroxidase, ascorbate acid, and reduced glutathione in T1 and higher dehydroascorbate reductase and monodehydroascorbate in T2. Overall, antioxidant enzyme activity in roots was higher near the container wall in T1 while far from the container wall in T2. Excessive and uneven Cu distribution and oxidative stress biomarkers effectively inhibited peripheral root elongation and entanglement. During this process, although antioxidant defense responses were induced, defense capacity was impaired by supra-optimal Cu.
在容器内壁涂上高浓度的铜(Cu)可通过抑制根尖伸长来防止根系缠绕。然而,靠近和远离容器壁的根系对铜的吸收是否存在差异,从而引发不同的防御反应,仍不确定。将两年生的樟树种植在以乳胶为载体、涂有120(T1)和200(T2)g/L Cu(OH)₂的容器中。处理六个月后,仅观察到涂有乳胶的容器(T0)和对照容器中有明显的根系缠绕,而T1和T2中没有缠绕现象。Cu(OH)₂处理增加了土壤和根系中的铜浓度,在T1和T2中表现出显著的位置差异(近壁与远壁)。T1和T2中容器壁附近的根系铜浓度分别比远离容器壁的高出3.5倍和3.0倍,比对照高出19.3倍和32.1倍。氧化应激生物标志物随着根系铜浓度的增加而增加,在T2中容器壁附近含量最高。过量的铜增加了抗氧化酶活性和非酶抗氧化剂含量,T1中的超氧化物歧化酶、谷胱甘肽还原酶、谷胱甘肽过氧化物酶、抗坏血酸过氧化物酶、抗坏血酸和还原型谷胱甘肽含量较高,T2中的脱氢抗坏血酸还原酶和单脱氢抗坏血酸含量较高。总体而言,T1中根系在容器壁附近的抗氧化酶活性较高,而T2中远离容器壁处较高。过量且不均匀的铜分布和氧化应激生物标志物有效地抑制了外周根的伸长和缠绕。在此过程中,尽管诱导了抗氧化防御反应,但超最佳浓度的铜损害了防御能力。