Qi Hang, Ye Fuxing, Wang Yingfan, Sun Kaiqi
Tianjin Key Laboratory of Advanced Joining Technology, School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China.
Key Lab of Advanced Ceramics and Machining Technology of Ministry of Education, Tianjin 300072, China.
Materials (Basel). 2025 Jun 17;18(12):2853. doi: 10.3390/ma18122853.
Ultrasonic welding, as a solid-state connection technology, has attracted considerable attention. The traditional ultrasonic welding sonotrode is not conducive to the study of the bonding mechanism of a straight interface, while the ultrasonic additive sonotrode does not have this problem. In this study, a special ultrasonic welding sonotrode was designed to form the joint, which is identical to ultrasonic additive manufacturing, to reveal its interfacial bonding mechanism between layers. Firstly, the linear metallurgical bonding density (LMD) of the joint is found to be positively correlated with welding time and negatively with welding pressure. Furthermore, the joint interface undergoes recrystallization after intense plastic deformation, with the obstruction of surface deformation by interface block resulting in the formation of a non-straight interface, which is beneficial to the formation of metallurgical bonding. Finally, a new concept of "Interface Block" was proposed, which can be applied to explain the formation of metallurgical bonding at the interface in ultrasonic additive manufacturing.
超声焊接作为一种固态连接技术，已引起了广泛关注。传统的超声焊接换能器不利于对直线界面的结合机理进行研究，而超声增材制造换能器则不存在这一问题。在本研究中，设计了一种特殊的超声焊接换能器来形成接头，该接头与超声增材制造相同，以揭示其层间界面结合机理。首先，发现接头的线性冶金结合密度（LMD）与焊接时间呈正相关，与焊接压力呈负相关。此外，接头界面在剧烈塑性变形后会发生再结晶，界面块对表面变形的阻碍导致形成非直线界面，这有利于冶金结合的形成。最后，提出了“界面块”这一新概念，可用于解释超声增材制造中界面处冶金结合的形成。
