Lee Sangmin, Kim Yeong Kwon, Noh Jongmin, Jang Byung Chul, Lee Sungjoo
SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Republic of Korea.
Department of Nano Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea.
ACS Nano. 2025 Aug 19;19(32):29028-29048. doi: 10.1021/acsnano.5c07260. Epub 2025 Aug 5.
Two-dimensional (2D) materials and van der Waals (vdW) heterostructures have emerged as key enablers in addressing the fundamental limitations of silicon-based technologies, driving advancements in next-generation electronic systems. Their high carrier mobility, tunable electronic characteristics, and absence of dangling bonds, combined with their compatibility with thin-film fabrication and wafer-scale integration, allow for the seamless integration of memory, logic, and sensing into compact, energy-efficient architectures. This review highlights the transformative role of 2D materials and vdW heterostructures in reshaping computing paradigms, focusing on emerging computing (in-memory, in-sensor, bioinspired, probabilistic, and quantum) and digital security (true random number generator (TRNG) and physical unclonable functions (PUFs)). By overcoming memory-wall challenges and enabling ultralow latency and parallel processing, these advancements provide tailored solutions for artificial intelligence, edge computing, and the Internet of Things. Furthermore, the physical properties of 2D materials─including scalability, high carrier mobility, spin-orbit coupling, and quantum fluctuations─expand possibilities across computing domains. These properties not only enhance emerging computing technologies but also strengthen entropy-based random number generation and variability-driven security mechanisms in digital security applications. To fully realize these advancements and the transition from fundamental research to large-scale implementation, continued progress in materials engineering and device fabrication is essential for achieving scalable, energy-efficient, and multifunctional computing systems.
二维（2D）材料和范德华（vdW）异质结构已成为解决硅基技术基本局限性的关键因素，推动了下一代电子系统的发展。它们具有高载流子迁移率、可调节的电子特性以及不存在悬空键，再加上它们与薄膜制造和晶圆级集成的兼容性，使得能够将内存、逻辑和传感无缝集成到紧凑、节能的架构中。本综述强调了二维材料和范德华异质结构在重塑计算范式方面的变革性作用，重点关注新兴计算（内存内、传感器内、仿生、概率和量子计算）和数字安全（真随机数发生器（TRNG）和物理不可克隆功能（PUF））。通过克服内存墙挑战并实现超低延迟和并行处理这些进步为人工智能、边缘计算和物联网提供了量身定制的解决方案。此外，二维材料的物理特性，包括可扩展性、高载流子迁移率、自旋轨道耦合和量子涨落，拓展了整个计算领域的可能性。这些特性不仅增强了新兴计算技术，还强化了数字安全应用中基于熵的随机数生成和变异性驱动的安全机制。为了充分实现这些进步并从基础研究过渡到大规模实施，材料工程和器件制造方面的持续进展对于实现可扩展、节能和多功能计算系统至关重要。
