Change in creep rate and microstructure in an aged, low-copper amalgam.

Low-copper amalgams aged at 37 degrees C, 50 degrees C, 60 degrees C, 70 degrees C, and 80 degrees C for periods of 7 and 30 days were examined using a scanning electron microscope and an x-ray diffractometer. Gamma-one Ag-Hg grain size and gamma 2 Sn-Hg volume fraction, and surface area were determined by quantitative metallography. At 60 degrees C and below, gamma 1 was the predominant matrix phase. Little beta 1 Ag-Hg was found. In this temperature range, both gamma 1 grain size and ADA creep were found to obey an Arrhenius law. A linear relationship was found between the log of the mean ADA creep and the mean gamma 1 grain size. Above 60 degrees C, the gamma 1 phases and the majority of the gamma Ag-Sn particles disappeared. In their place, beta 1 appeared. Gamma-two volume fraction increased during aging at temperatures over 60 degrees C, but a coarsening of gamma 2, reflected in a decrease in gamma 2 surface area per unit volume, also took place. Aging for 30 days or less resulted in decreases in ADA creep. At 60 degrees C and below, the decrease was caused by increases in gamma 1 grain size. Above 60 degrees C, the decrease in ADA creep was caused by several factors, one of which was the appearance of large beta 1 grains.