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金刚石表面超声振荡辅助镀镍的研究

Investigation into Ultrasonic Oscillation-Assisted Nickel Electroplating onto a Diamond Surface.

作者信息

Fan Qingming, Guo Bin, Su Guokang, Qi Hui, Li Pengfan, Zhang Chuanyun, Cheng Kai

机构信息

School of Mechatronic Engineering, Xi'an Technological University, Xi'an 710021, China.

Shaanxi Engineering Research Center of Digital Precision Electrochemical Machining, Xi'an 710021, China.

出版信息

Micromachines (Basel). 2025 Aug 21;16(8):962. doi: 10.3390/mi16080962.

DOI:10.3390/mi16080962
PMID:40872469
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12388650/
Abstract

At present, there are some challenging issues for diamond electroplating devices, such as poor particle-cathode contact uniformity, low conductivity, inefficient deposition, and complex disassembly/cleaning process of the device. To overcome these issues, an ultrasonic oscillation-assisted nickel electroplating device is innovatively designed and presented in this paper. The device features: (1) innovative architecture enabling rapid disassembly; (2) ultrasonic enhancement of diamond particle mobility (frequency × amplitude); (3) optimized electrical contact interfaces. In this paper, the effects of electroplating current, output power of ultrasonic oscillator and diamond particle size on nickel electroplating onto diamond surface are further studied particularly by ultrasonic assisted electroplating. The experimental results show that the ultrasonic oscillation assisted electroplating greatly improves the uniformity of the coating on the diamond surface and effectively prevents the adhesion between diamond particles. While the process parameters are electroplating current of 3 A, output power of ultrasonic oscillator 900 W, diamond particle size of 120/140, the weight-gain rate is 20.6%, the nickel content of the coating reaches 81.95%, and the coating is excellent uniformed without agglomeration. The research presented provides fundamental understanding for further development and application of ultrasonic oscillation-assisted electroplating technology particularly for broad precision engineering purposes.

摘要

目前,金刚石电镀装置存在一些具有挑战性的问题,例如颗粒与阴极的接触均匀性差、导电性低、沉积效率低以及装置的拆卸/清洗过程复杂。为了克服这些问题,本文创新性地设计并展示了一种超声振荡辅助镍电镀装置。该装置具有以下特点:(1)创新的结构,便于快速拆卸;(2)通过超声提高金刚石颗粒的迁移率(频率×振幅);(3)优化的电接触界面。本文通过超声辅助电镀,进一步特别研究了电镀电流、超声振荡器的输出功率和金刚石颗粒尺寸对金刚石表面镍电镀的影响。实验结果表明,超声振荡辅助电镀大大提高了金刚石表面涂层的均匀性,并有效防止了金刚石颗粒之间的粘连。当工艺参数为电镀电流3 A、超声振荡器输出功率900 W、金刚石颗粒尺寸120/140时,增重率为20.6%,涂层镍含量达到81.95%,涂层均匀性极佳,无团聚现象。本文的研究为超声振荡辅助电镀技术的进一步发展和应用提供了基础认识,特别是在广泛的精密工程领域。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/89b262fa5d00/micromachines-16-00962-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/21b83ef651a0/micromachines-16-00962-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/13862bc7f7e7/micromachines-16-00962-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/bed372f5a9cf/micromachines-16-00962-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/503fd1ae26b0/micromachines-16-00962-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/a87f2f71651b/micromachines-16-00962-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/e07533536a08/micromachines-16-00962-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/8119f322c1bd/micromachines-16-00962-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/65c7d318f9c3/micromachines-16-00962-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/ca4108e1aee7/micromachines-16-00962-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/89b262fa5d00/micromachines-16-00962-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/21b83ef651a0/micromachines-16-00962-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/13862bc7f7e7/micromachines-16-00962-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/bed372f5a9cf/micromachines-16-00962-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/503fd1ae26b0/micromachines-16-00962-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/a87f2f71651b/micromachines-16-00962-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/e07533536a08/micromachines-16-00962-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/8119f322c1bd/micromachines-16-00962-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/65c7d318f9c3/micromachines-16-00962-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/ca4108e1aee7/micromachines-16-00962-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8574/12388650/89b262fa5d00/micromachines-16-00962-g010.jpg

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本文引用的文献

1
Solving the Bonding Problem of the Ni Thin Coating with the Ultrasonic Assisted Electrochemical Potential Activation Method.用超声辅助电化学势激活法解决镍薄膜涂层的结合问题。
Micromachines (Basel). 2022 Dec 23;14(1):34. doi: 10.3390/mi14010034.