Ruiz Kärkkäinen Paloma, Vihervaara Anton, Hatanpää Timo, Kohopää Katja, Heikkilä Mikko J, Marín-Suárez Marco, Grigoras Kestutis, Mizohata Kenichiro, Popov Georgi, Chundak Mykhailo, Kemppinen Antti, Putkonen Matti, Ritala Mikko
Department of Chemistry, University of Helsinki, FI-00014 Helsinki, Finland.
VTT Technical Research Centre of Finland Ltd, QTF Centre of Excellence, P.O. Box 1000, FI-02044 Espoo, Finland.
Chem Mater. 2025 Aug 19;37(17):6770-6781. doi: 10.1021/acs.chemmater.5c01456. eCollection 2025 Sep 9.
Transition metal carbonitrides (TMCN) are stable materials with excellent catalytic and superconductive properties. Atomic layer deposition (ALD) stands out as the optimal method for the fabrication of these materials, enabling their use in future applications. In this study, we deposit ALD NbC N films at 250-450 °C with NbF and 1,4-bis-(trimethylsilyl)-1,4-dihydropyrazine on Si, Ru, TiN, and soda lime glass. We analyze the film growth characteristics, composition, and phase. The films show substrate-enhanced growth on Si with a growth per cycle (GPC) of 1.3 Å. Additionally, the films were superconductive as-deposited and had a superconducting critical temperature ( ) of 14.5 K after annealing at 950 °C. This work expands the range of TMCNs deposited by ALD and demonstrates the applicability of ALD for thin film materials with a high .
过渡金属碳氮化物(TMCN)是具有优异催化和超导性能的稳定材料。原子层沉积(ALD)作为制备这些材料的最佳方法脱颖而出,使其能够应用于未来的领域。在本研究中,我们在250-450°C下,使用NbF和1,4-双(三甲基硅基)-1,4-二氢吡嗪在硅、钌、氮化钛和钠钙玻璃上沉积ALD NbC N 薄膜。我们分析了薄膜的生长特性、成分和相。这些薄膜在硅上表现出衬底增强生长,每个周期的生长速率(GPC)为1.3 Å。此外,薄膜在沉积时即为超导,在950°C退火后超导临界温度( )为14.5 K。这项工作扩展了通过ALD沉积的TMCN的范围,并证明了ALD对于具有高 的薄膜材料的适用性。