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用于3D塑料电路载体的组装与互连技术：技术、材料及应用概述

Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications.

作者信息

Werum Kai, Eberhardt Wolfgang, Reenaers Dieter, Mager Thomas, Endl Mika, Zimmermann André, Deferme Wim

机构信息

Hahn-Schickard-Gesellschaft für Angewandte Forschung e.V., 70569 Stuttgart, Germany.

Institute for Micro Integration (IFM), University of Stuttgart, 70569 Stuttgart, Germany.

出版信息

Micromachines (Basel). 2025 Aug 26;16(9):980. doi: 10.3390/mi16090980.

DOI:10.3390/mi16090980
PMID:41011871
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12471658/
Abstract

This paper aims to present an overview of the state-of-the-art materials and technologies that can be used to create electronic circuits on 3D plastic carriers also known as 3D electronics. Strategies for print-based and laser-based 3D electronics will be discussed as well as the techniques to apply the circuit carrier and the way interconnection technology can be used to combine electronic components on top of the circuit carrier. A basic explanation of the functional principles, materials, and applications is given for different substrate and interconnection technologies. The aim is to make it easier to compare different technologies and its required materials to make the right decisions on what technology is best suited for the job. For this purpose, comparison tables for 3D plastic circuit carrier technologies and substrate materials considering their temperature stability were created. It can be concluded that there are a lot of influencing factors that determine which technologies are best suited for application. The most important factors are the 3D complexity and the field of application, the required structure size of the circuit, and the required production quantity.

摘要

本文旨在概述可用于在3D塑料载体（也称为3D电子产品）上创建电子电路的最新材料和技术。将讨论基于印刷和基于激光的3D电子产品的策略，以及应用电路载体的技术和使用互连技术在电路载体顶部组合电子元件的方法。针对不同的基板和互连技术，对功能原理、材料和应用进行了基本解释。目的是更易于比较不同技术及其所需材料，以便就最适合该工作的技术做出正确决策。为此，创建了考虑其温度稳定性的3D塑料电路载体技术和基板材料的比较表。可以得出结论，有许多影响因素决定哪种技术最适合应用。最重要的因素是3D复杂性和应用领域、电路所需的结构尺寸以及所需的产量。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/40f3/12471658/87d9424517fa/micromachines-16-00980-g018.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/40f3/12471658/87d9424517fa/micromachines-16-00980-g018.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/40f3/12471658/87d9424517fa/micromachines-16-00980-g018.jpg

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