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用于透射电子显微镜横截面分析的金刚石薄膜超薄切片术。

Ultramicrotomy of diamond films for TEM cross-section analysis.

作者信息

Swab P

机构信息

Materials Research Laboratory, Pennsylvania State University, University Park 16802, USA.

出版信息

Microsc Res Tech. 1995 Jul 1;31(4):308-10. doi: 10.1002/jemt.1070310408.

Abstract

Ultramicrotomy has been used to prepare TEM cross-sections of typical hard dielectric, semiconductor, and metal coatings, providing a critical capability in the study of structure-property relationships of thin films. Ultramicrotomy of thin film coatings requires meticulous attention to technique and handling. The sample to be microtomed must be very small, well bonded to the epoxy embedding medium, and precisely oriented. In this article we report the ability to microtome TEM cross-sections of diamond and cubic boron-nitride (cBN) coatings.

摘要

超薄切片术已被用于制备典型硬电介质、半导体和金属涂层的透射电子显微镜(TEM)横截面,这为研究薄膜的结构-性能关系提供了一项关键能力。薄膜涂层的超薄切片术需要对技术和操作予以细致关注。待切片的样品必须非常小,与环氧树脂包埋介质良好结合,并且精确取向。在本文中,我们报告了对金刚石和立方氮化硼(cBN)涂层进行超薄切片以获得TEM横截面的能力。

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