Butson T J, Nicholls J I, Ma T, Harper R J
Department of Restorative Dentistry, School of Dentistry, University of Washington, Seattle 98195.
Int J Prosthodont. 1993 Sep-Oct;6(5):468-74.
This research investigated the fatigue life (ie, the number of cycles of a given stress that can be sustained by a sample prior to catastrophic failure) of metal ceramic soldering. One metal ceramic alloy was joined using four postceramic solders and one preceramic solder. All specimens received appropriate heat treatment simulating ceramic application although no porcelain was applied. Five specimens were fabricated for each solder type, and a 35,000 psi (241.4 MPa) fatigue stress was applied to each solder joint during specimen testing. The test variable was the number of stress cycles required to fail each specimen. The postceramic solders exhibited significantly higher fatigue lives than did the preceramic solder. Scanning electron microscope analysis showed that the preceramic solder not only exhibited a larger grain size, but also showed micropores between these grains.
本研究调查了金属陶瓷焊接的疲劳寿命（即样品在灾难性失效前能够承受给定应力的循环次数）。使用四种陶瓷后焊料和一种陶瓷前焊料连接一种金属陶瓷合金。尽管未施加瓷层，但所有试样都接受了模拟陶瓷应用的适当热处理。每种焊料类型制作五个试样，在试样测试期间对每个焊点施加35,000磅力/平方英寸（241.4兆帕）的疲劳应力。测试变量是每个试样失效所需的应力循环次数。陶瓷后焊料的疲劳寿命显著高于陶瓷前焊料。扫描电子显微镜分析表明，陶瓷前焊料不仅晶粒尺寸较大，而且在这些晶粒之间还存在微孔。
