Cheng A C, Chai J Y, Gilbert J, Jameson L M
Northwestern University Dental School, Chicago, Ill.
J Prosthet Dent. 1994 Jul;72(1):8-15. doi: 10.1016/0022-3913(94)90208-9.
The stiffness of soldered connectors fabricated with the gas-oxygen torch technique was compared with those fabricated with the infrared technique. Untreated solder materials were used as controls. Untreated solder materials of gold-palladium, palladium-silver, and chromium-cobalt alloys exhibited significantly higher stiffness than the soldered specimens fabricated with either method. There was no significant difference between the gas-oxygen torch and the infrared groups of the gold-palladium and palladium-silver alloys. Photomicrographs revealed that the soldered specimens displayed porosities. For the chromium-cobalt alloy, the infrared group demonstrated significantly higher stiffness than the gas-oxygen torch group. Photomicrographs also disclosed that the chromium-cobalt alloy soldered with the gas-oxygen torch technique had a significant heat-affected zone.
将采用气氧焊炬技术制造的焊接连接器的硬度与采用红外技术制造的焊接连接器的硬度进行了比较。未处理的焊料材料用作对照。金钯、钯银和铬钴合金的未处理焊料材料的硬度明显高于用任何一种方法制造的焊接试样。金钯和钯银合金的气氧焊炬组和红外组之间没有显著差异。金相照片显示，焊接试样存在孔隙。对于铬钴合金，红外组的硬度明显高于气氧焊炬组。金相照片还显示，用气氧焊炬技术焊接的铬钴合金有明显的热影响区。
