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重新定位的陶瓷托槽的剪切/剥离粘结强度。

Shear/peel bond strength of repositioned ceramic brackets.

作者信息

Gaffey P G, Major P W, Glover K, Grace M, Koehler J R

机构信息

Division of Orthodontics, University of Alberta, Edmonton, Canada.

出版信息

Angle Orthod. 1995;65(5):351-7. doi: 10.1043/0003-3219(1995)065<0351:PBSORC>2.0.CO;2.

DOI:10.1043/0003-3219(1995)065<0351:PBSORC>2.0.CO;2
PMID:8526294
Abstract

Improper orthodontic bracket position may necessitate bracket removal and rebonding to establish correct bracket position. This procedure is necessary to use efficient orthodontic mechanics. The purpose of the study was to investigate (1) the amount of bonding resin remaining on single crystal bracket bases following electrothermal debonding, and (2) the bond strength of rebonded single crystal ceramic brackets under different treatment conditions. The bases of debonded, single crystal ceramic brackets (n = 100) were inspected for resin, classified with an adaptation of the adhesive remnant index (ARI), and evenly assigned to four experimental groups (n = 25). Groups were (1) silane coupling agent, (2) heat plus silane coupling agent, (3) hydrofluoric acid plus silane coupling agent, and (4) heat plus hydrofluoric acid plus silane coupling agent. An additional group of brackets not previously bonded was used as the control (n = 25). The brackets were bonded to 125 fresh bovine teeth. A force was applied 1 mm from the bracket-resin interface by a testing machine. The force measured in this experiment was shear/peel and the ratio of shear to peel was 0.53. The AI index showed 79% of the brackets had no resin on their bases. The shear/peel bond strnegth was significantly greater for the control group than all other groups (P < 0.01). Treatment of electrothermally debonded ceramic brackets with silane or heat plus silane resulted in bond strength greater than 9 MPa. The use of hydrofluoric acid significantly reduced the bond strength below 2 MPa.

摘要

不当的正畸托槽位置可能需要去除并重新粘结托槽以确立正确的托槽位置。此操作对于使用有效的正畸力学是必要的。本研究的目的是调查:(1)电热脱粘后单晶托槽基底上残留的粘结树脂量;(2)在不同处理条件下重新粘结的单晶陶瓷托槽的粘结强度。检查脱粘的单晶陶瓷托槽(n = 100)的基底有无树脂,采用改良的粘结剂残留指数(ARI)进行分类,并将其均匀分为四个实验组(n = 25)。分组如下:(1)硅烷偶联剂组;(2)加热加硅烷偶联剂组;(3)氢氟酸加硅烷偶联剂组;(4)加热加氢氟酸加硅烷偶联剂组。另外一组未预先粘结的托槽用作对照组(n = 25)。将托槽粘结到125颗新鲜的牛牙上。通过测试机在距托槽 - 树脂界面1 mm处施加力。本实验中测量的力为剪切/剥离力,剪切与剥离的比例为0.53。ARI指数显示79%的托槽基底无树脂。对照组的剪切/剥离粘结强度显著高于所有其他组(P < 0.01)。用硅烷或加热加硅烷处理电热脱粘的陶瓷托槽后,粘结强度大于9 MPa。使用氢氟酸会使粘结强度显著降低至2 MPa以下。

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