Scott L, LaFoe D, Weil C F
Department of Biological Sciences, University of Idaho, Moscow 83844, USA.
Genetics. 1996 Jan;142(1):237-46. doi: 10.1093/genetics/142.1.237.
Mobile elements transposing via DNA intermediates often leave small rearrangements, or "transposon footprints," at sites where they excise. Each excision event leaves its own footprint and, at any given site, these vary in size and sequence. Footprint formation involves DNA repair of sequences flanking the element. We have analyzed the footprints formed by a 2-kb Ds element excising from six different sites in exons of the maize waxy (Wx) gene. We find that groups of footprints left at individual sites are surprisingly nonrandom; different excision products predominate consistently at each site. Less frequent footprints left by each insertion appear related to the predominant type. The data suggest that flanking sequences affect the DNA repair processes associated with element excision. Two models have been proposed to explain footprint formation, one featuring a 5' exonuclease and the other featuring hairpin loop formation and an endonuclease. Our data have interesting implications for both these models. Evidence is also presented to support the presence of a separate excision mechanism that can remove Ac/Ds elements without leaving any footprint and that operates in parallel with the footprint-forming mechanism.
通过DNA中间体进行转座的移动元件通常会在其切除的位点留下小的重排,即“转座子足迹”。每次切除事件都会留下其自身的足迹,并且在任何给定位点,这些足迹的大小和序列各不相同。足迹形成涉及元件侧翼序列的DNA修复。我们分析了从玉米蜡质(Wx)基因外显子的六个不同位点切除的一个2kb Ds元件形成的足迹。我们发现,在各个位点留下的足迹组出人意料地并非随机;在每个位点,不同的切除产物始终占主导。每次插入留下的较少见的足迹似乎与主要类型相关。数据表明,侧翼序列会影响与元件切除相关的DNA修复过程。已经提出了两种模型来解释足迹形成,一种以5'核酸外切酶为特征,另一种以发夹环形成和内切酶为特征。我们的数据对这两种模型都有有趣的启示。还提供了证据来支持存在一种单独的切除机制,该机制可以去除Ac/Ds元件而不留下任何足迹,并且与形成足迹的机制并行运作。