Dantzer F, Nasheuer H P, Vonesch J L, de Murcia G, Ménissier-de Murcia J
UPR 9003 du Centre National de la Recherche Scientifique 'Cancérogenèse et Mutagenèse Moléculaire et Structurale', Laboratoire correspondant du CEA no. 14, Ecole Supérieure de Biotechnologie de Strasbourg, Illkirch-Graffenstaden, France.
Nucleic Acids Res. 1998 Apr 15;26(8):1891-8. doi: 10.1093/nar/26.8.1891.
Poly(ADP-ribose) polymerase (PARP) is an element of the DNA damage surveillance network evolved by eukaryotic cells to cope with numerous environmental and endogenous genotoxic agents. PARP has been found to be involved in vivo in both cell proliferation and base excision repair of DNA. In this study the interaction between PARP and the DNA polymerase alpha-primase tetramer has been examined. We provide evidence that in proliferating cells: (i) PARP is physically associated with the catalytic subunit of the DNA polymerase alpha-primase tetramer, an association confirmed by confocal microscopy, demonstrating that both enzymes are co-localized at the nuclear periphery of HeLa cells; (ii) this interaction requires the integrity of the second zinc finger of PARP and is maximal during the S and G2/M phases of the cell cycle; (iii) PARP-deficient cells derived from PARP knock-out mice exhibited reduced DNA polymerase activity, compared with the parental cells, a reduction accentuated following exposure to sublethal doses of methylmethanesulfonate. Altogether, the present results strongly suggest that PARP participates in a DNA damage survey mechanism implying its nick-sensor function as part of the control of replication fork progression when breaks are present in the template.
聚(ADP - 核糖)聚合酶(PARP)是真核细胞进化出的DNA损伤监测网络的一个组成部分,用于应对多种环境和内源性基因毒性剂。已发现PARP在体内参与细胞增殖和DNA的碱基切除修复。在本研究中,对PARP与DNA聚合酶α - 引发酶四聚体之间的相互作用进行了研究。我们提供的证据表明,在增殖细胞中:(i)PARP与DNA聚合酶α - 引发酶四聚体的催化亚基存在物理关联,共聚焦显微镜证实了这种关联,表明这两种酶共定位于HeLa细胞的核周边;(ii)这种相互作用需要PARP第二个锌指的完整性,并且在细胞周期的S期和G2/M期达到最大值;(iii)与亲代细胞相比,来自PARP基因敲除小鼠的PARP缺陷细胞表现出DNA聚合酶活性降低,在暴露于亚致死剂量的甲基磺酸甲酯后这种降低更加明显。总之,目前的结果强烈表明,PARP参与了一种DNA损伤监测机制,这意味着当模板中存在断裂时,其切口传感器功能作为复制叉进展控制的一部分。