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蚀刻剂、蚀刻时间和硅烷预处理对复合树脂与瓷粘结强度的影响。

Effect of etchant, etching period, and silane priming on bond strength to porcelain of composite resin.

作者信息

Chen J H, Matsumura H, Atsuta M

机构信息

Nagasaki University School of Dentistry, Department of Fixed Prosthodontics, Japan.

出版信息

Oper Dent. 1998 Sep-Oct;23(5):250-7.

PMID:9863446
Abstract

The purpose of this study was to evaluate the effect of etching and silane priming on bond strength to a feldspathic porcelain (VMK 68) of a composite resin (Clearfil APX). Two hydrofluoric acid etchants (2.5% and 5%) and seven different etching times (0, 30, 60, 90, 120, 150, and 180 seconds) were used to etch the porcelain specimens respectively. A self-curing bonding agent containing a silane coupler (Clearfil Porcelain Bond) was used on both etched and unetched porcelain surfaces. Etched relief patterns were observed by means of a scanning electron microscope, and the bond strengths between the photocured composite resin and the porcelain were determined. Scanning electron micrographs revealed complicated etching patterns with increased etching time periods. Shear testing results showed that the bond strength to the unetched porcelain of the composite resin was very low, and that etching periods for more than 30 seconds effectively enhanced the bond strength. Of the two etching agents applied to the unsilanated porcelain, the buffered 2.5% etchant produced higher bond strengths than the 5% etchant for all etching time periods except for 180 seconds. Silane priming was effective and critical for improving bond strength to the porcelain. Application of the silane bonding agent to the porcelain after hydrofluoric acid etching appeared to be suitable for achieving consistent bonding between the composite resin and the porcelain.

摘要

本研究的目的是评估蚀刻和硅烷预处理对复合树脂(Clearfil APX)与长石质瓷(VMK 68)粘结强度的影响。分别使用两种氢氟酸蚀刻剂(2.5%和5%)和七种不同的蚀刻时间(0、30、60、90、120、150和180秒)对瓷标本进行蚀刻。在蚀刻和未蚀刻的瓷表面均使用含硅烷偶联剂的自固化粘结剂(Clearfil Porcelain Bond)。通过扫描电子显微镜观察蚀刻后的浮雕图案,并测定光固化复合树脂与瓷之间的粘结强度。扫描电子显微镜照片显示,随着蚀刻时间的增加,蚀刻图案变得复杂。剪切测试结果表明,复合树脂与未蚀刻瓷的粘结强度非常低,蚀刻30秒以上能有效提高粘结强度。在未进行硅烷化处理的瓷上使用的两种蚀刻剂中,除180秒外,在所有蚀刻时间段内,缓冲的2.5%蚀刻剂产生的粘结强度均高于5%蚀刻剂。硅烷预处理对提高与瓷的粘结强度有效且至关重要。氢氟酸蚀刻后在瓷上应用硅烷粘结剂似乎适合于在复合树脂与瓷之间实现一致的粘结。

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