Ito T, Okazaki S
Fujitsu Laboratories Ltd, Atsugi, Japan.
Nature. 2000 Aug 31;406(6799):1027-31. doi: 10.1038/35023233.
The phenomenal rate of increase in the integration density of silicon chips has been sustained in large part by advances in optical lithography--the process that patterns and guides the fabrication of the component semiconductor devices and circuitry. Although the introduction of shorter-wavelength light sources and resolution-enhancement techniques should help maintain the current rate of device miniaturization for several more years, a point will be reached where optical lithography can no longer attain the required feature sizes. Several alternative lithographic techniques under development have the capability to overcome these resolution limits but, at present, no obvious successor to optical lithography has emerged.
硅芯片集成密度惊人的增长速度在很大程度上得益于光刻技术的进步——光刻技术是一种对半导体器件和电路图案进行加工并引导其制造的工艺。尽管引入更短波长的光源和分辨率增强技术应有助于在未来几年内维持当前的器件小型化速度,但终究会达到一个临界点,届时光刻技术将无法再实现所需的特征尺寸。目前正在研发的几种替代光刻技术有能力克服这些分辨率限制,但目前尚未出现光刻技术的明显继任者。