Suzuki Takeharu, Tanner Philip, Thiel David V
Griffith University, School of Microelectronic Engineering, Brisbane, Queensland, Australia.
Analyst. 2002 Oct;127(10):1342-6. doi: 10.1039/b205085d.
The effect of non-plasma and plasma treated polyimide-based humidity sensors is presented. Pure oxygen was used to etch polyimide in a plasma etcher. The sensor treated in a plasma exhibited higher sensitivity and faster response speed against moisture. The plasma treated sensor had 3.4 times the sensitivity and responded almost twice as fast as the non-plasma treated sensor. A further comparison of sensor outputs, sensitivity and response speed are presented. Chemical analysis of the polyimide surface was carried out by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (ATR-FTIR). XPS and ATR-FTIR showed the increase in carbonyl carbon bonds, C=O, after the plasma treatment. Geometrical modification was observed by atomic force microscopy (AFM). It showed considerable surface roughness after the plasma treatment. O2 plasma treatment improved the sensitivity, and reduced the hysteresis of the sensor due to the increase in C=O bonds in the polyimide.
介绍了非等离子体处理和等离子体处理的聚酰亚胺基湿度传感器的效果。在等离子体蚀刻机中使用纯氧蚀刻聚酰亚胺。经等离子体处理的传感器对湿度表现出更高的灵敏度和更快的响应速度。经等离子体处理的传感器的灵敏度是非等离子体处理传感器的3.4倍，响应速度几乎是非等离子体处理传感器的两倍。还对传感器输出、灵敏度和响应速度进行了进一步比较。通过X射线光电子能谱（XPS）和傅里叶变换红外光谱（ATR-FTIR）对聚酰亚胺表面进行了化学分析。XPS和ATR-FTIR表明，等离子体处理后羰基碳键（C=O）增加。通过原子力显微镜（AFM）观察到几何结构的改变。结果表明，等离子体处理后表面粗糙度显著增加。由于聚酰亚胺中C=O键的增加，O2等离子体处理提高了传感器的灵敏度，并降低了传感器的滞后现象。
