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高度排列的DNA链在硅芯片上的组装。

Assembly of highly aligned DNA strands onto Si chips.

作者信息

Zhang Jianming, Ma Yufeng, Stachura Sylwia, He Huixin

机构信息

Chemistry Department, Rutgers University, Newark, NJ 07102, USA.

出版信息

Langmuir. 2005 Apr 26;21(9):4180-4. doi: 10.1021/la050129s.

Abstract

This paper reports a robust and efficient approach to assemble highly aligned DNA strands onto Si chips. The method combines advantages from molecular combing and microcontact printing to realize controlling both the density and direction of DNA strands on the Si chip. In addition, it also can be utilized to prepare stretched DNA structures on solid surfaces. Compared to approaches that use molecular combing directly on silanated surfaces, the stretched single-chain DNA structures are straighter. Furthermore, by exploiting the hydrophobic property of the intrinsic poly(dimethylsiloxane) stamp, this study also describes a simple way to produce straight bundled DNA arrays on Si and other substrates.

摘要

本文报道了一种将高度对齐的DNA链组装到硅芯片上的强大且高效的方法。该方法结合了分子梳技术和微接触印刷技术的优点,以实现对硅芯片上DNA链的密度和方向的控制。此外,它还可用于在固体表面制备拉伸的DNA结构。与直接在硅烷化表面上使用分子梳技术的方法相比,拉伸的单链DNA结构更直。此外,通过利用本征聚二甲基硅氧烷印章的疏水特性,本研究还描述了一种在硅和其他基板上制备直的束状DNA阵列的简单方法。

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