Hsu Yi-Chu, Chen Tang-Yuan
Department of Mechanical Engineering, Southern Taiwan University of Technology, Yung Kang City, Tainan County, Taiwan.
Biomed Microdevices. 2007 Aug;9(4):513-22. doi: 10.1007/s10544-007-9059-1.
This work examines numerous significant process parameters in the solvent-assistant Polymethyl methacrylate (PMMA) bonding scheme and presents two Micro-total-analysis System (micro-TAS) devices generated by adopting the optimal bonding parameters. The process parameters considered were heating temperature, applied loading, duration and solution. The effects of selected process parameters on bonding dimensions loss and strength, and subsequent optimal setting of the parameters were accomplished using Taguchi's scheme. Additionally, two micro-TAS devices were realized using a static paraffin microvalve and a dynamic diffuser micropump. The PMMA chips were carved using a CO2 laser that patterned device microchannels and microchambers. The operation principles, fabrication processes and experimental performance of the devices are discussed. This bonding technique has numerous benefits, including high bonding strength (240 kgf/cm2) and low dimension loss (2-6%). For comparison, this work also demonstrates that the normal stress of this technology is 2-15 times greater than that of other bonding technologies, including hot embossing, anodic bonding, direct bonding and thermal fusion bonding.
本研究考察了溶剂辅助聚甲基丙烯酸甲酯（PMMA）键合方案中的众多重要工艺参数，并展示了采用最佳键合参数生成的两种微全分析系统（micro-TAS）设备。所考虑的工艺参数包括加热温度、施加负载、持续时间和溶液。通过田口方法研究了所选工艺参数对键合尺寸损失和强度的影响，以及随后参数的优化设置。此外，使用静态石蜡微阀和动态扩散器微泵实现了两种微TAS设备。PMMA芯片采用CO2激光雕刻，形成设备微通道和微腔。讨论了这些设备的工作原理、制造工艺和实验性能。这种键合技术有许多优点，包括高键合强度（240 kgf/cm2）和低尺寸损失（2-6%）。相比之下，本研究还表明，该技术的法向应力比其他键合技术（包括热压印、阳极键合、直接键合和热熔合键合）大2至15倍。
