Song In-Hyouk, Park Taehyun
Department of Engineering Technology, Texas State University, San Marcos, TX 78666, USA.
School of Mechanical Engineering, Kyungnam University, Changwon 51767, Korea.
Micromachines (Basel). 2017 Sep 20;8(9):284. doi: 10.3390/mi8090284.
Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (/) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers-PMMA to polycarbonate (PC)-to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection.
近年来，热塑性聚合物因其易于制造和成本低廉，已成为微流控芯片的常用材料。基于聚合物的微流控装置可以通过多种制造技术形成，如激光加工、注塑成型和热压花。本文介绍的一种新的键合工艺使用2.5%（/）的聚甲基丙烯酸甲酯（PMMA）溶液作为粘合剂层，将不同的聚合物——PMMA与聚碳酸酯（PC）——键合，用PC封闭PMMA微流控通道。该技术已成功地证明可将PMMA微芯片与PC膜键合。除了流体泄漏检查外，本文还通过剪切强度测试和裂纹开口方法给出了键合强度。
