You Jang-Woo, Kim Soohyun, Kim Daesuk
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Yusong-gu, Daejeon, 305-701, Republic of Korea.
Opt Express. 2008 Dec 8;16(25):21022-31. doi: 10.1364/oe.16.021022.
A novel high speed volumetric thickness profilometry based on a wavelength scanning full-field interferometer and its signal processing algorithm is described for a thin film deposited on pattern structures. A specially designed Michelson interferometer with a blocking plate in the reference path enables us to measure the volumetric thickness profile by decoupling two variables, thickness and profile, which affect the total phase function phi(k). We show experimentally that the proposed method provides a much faster solution in obtaining the volumetric thickness profile data while maintaining the similar level of accurate measurement capability as that of the least square fitting method.
本文描述了一种基于波长扫描全场干涉仪的新型高速体积厚度轮廓测量方法及其信号处理算法，用于测量沉积在图案结构上的薄膜。在参考光路中带有阻挡板的特殊设计的迈克尔逊干涉仪，使我们能够通过解耦影响总相位函数φ(k)的两个变量（厚度和轮廓）来测量体积厚度轮廓。我们通过实验表明，所提出的方法在获取体积厚度轮廓数据方面提供了更快的解决方案，同时保持了与最小二乘法拟合方法相似的精确测量能力水平。
