Okawa Seigo, Watanabe Kouichi
Division of Biomaterial Science, Department of Oral Health Science, Niigata University Graduate School of Medical and Dental Sciences, 5274 Gakkocho-dori 2, Chuo-ku, Niigata 951-8514, Japan.
Dent Mater J. 2009 Jan;28(1):68-74. doi: 10.4012/dmj.28.68.
Chemical mechanical polishing (CMP) of cpTi (Ti) was carried out using two types of slurries, acidic and basic colloidal silica containing H2O2 up to 3 wt%, to obtain flat and mirror-polished surfaces without any contaminated and reacted layers. Polishing behavior and surface properties were investigated using AFM, EPMA, and XPS. Weight loss of Ti polished by CMP using the basic slurry was larger than that using the acidic one, and surface roughness was less than 2 nm RMS when basic slurry containing 3 wt% H2O2 was used. Moreover, three kinds of chemical species, OH-, O2-, and H2O, were detected on the Ti surfaces polished by CMP using these slurries. Results of this study showed that CMP using colloidal silica containing H2O2 successfully created a mirror-polished surface without contaminated and reacted layers.
使用两种浆料对商业纯钛（cpTi，Ti）进行化学机械抛光（CMP），这两种浆料分别是酸性和碱性胶体二氧化硅，其中含有高达3 wt%的H2O2，以获得平整且镜面抛光的表面，且无任何污染层和反应层。使用原子力显微镜（AFM）、电子探针微区分析（EPMA）和X射线光电子能谱（XPS）研究了抛光行为和表面性能。使用碱性浆料通过CMP抛光的Ti的重量损失大于使用酸性浆料的情况，当使用含有3 wt% H2O2的碱性浆料时，表面粗糙度小于2 nm RMS（均方根粗糙度）。此外，在使用这些浆料通过CMP抛光的Ti表面检测到了三种化学物质，即OH-、O2-和H2O。本研究结果表明，使用含有H2O2的胶体二氧化硅进行CMP成功地创造了一个无污染层和反应层的镜面抛光表面。
