Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Small. 2009 Dec;5(23):2703-9. doi: 10.1002/smll.200900934.
Materials and methods to achieve electronics intimately integrated on the surfaces of substrates with complex, curvilinear shapes are described. The approach exploits silicon membranes in circuit mesh structures that can be deformed in controlled ways using thin, elastomeric films. Experimental and theoretical studies of the micromechanics of such curvilinear electronics demonstrate the underlying concepts. Electrical measurements illustrate the high yields that can be obtained. The results represent significant experimental and theoretical advances over recently reported concepts for creating hemispherical photodetectors in electronic eye cameras and for using printable silicon nanoribbons/membranes in flexible electronics. The results might provide practical routes to the integration of high performance electronics with biological tissues and other systems of interest for new applications.
介绍了在具有复杂曲线形状的基底表面上实现电子设备紧密集成的材料和方法。该方法利用了可以通过薄的弹性体薄膜以受控方式变形的电路网格结构中的硅膜。对这种曲线电子产品的微机械力学的实验和理论研究证明了这些基本概念。电测量说明了可以获得的高产量。与最近报道的用于在电子眼相机中创建半球形光电探测器以及在柔性电子产品中使用可印刷的硅纳米带/膜的概念相比,这些结果代表了重大的实验和理论进展。这些结果可能为高性能电子设备与生物组织和其他感兴趣的系统的集成提供实用途径,以应用于新的领域。