Elangovan T, Kuppusami P, Thirumurugesan R, Sudha C, Mohandas E, Mangalaraj D
Physical Metallurgy Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603102, India.
J Nanosci Nanotechnol. 2009 Sep;9(9):5436-40. doi: 10.1166/jnn.2009.1129.
Synthesis of nanocomposite thin films of CrN/Cu deposited on (100) Si and D-9 alloy substrates by pulsed magnetron sputtering as a function of copper content in the range 15.1-35.8 at.% is investigated. XRD analysis of the films deposited at 773 K with nitrogen flow rate of 10 sccm indicated that the films are nanorystalline and bi-phasic (fcc-CrN and fcc-Cu). Scanning electron microscopy showed a structureless morphology for CrN, while agglomerates were obtained for CrN/Cu nanocomposite thin films. Atomic force microscopy also confirmed the agglomeration of particles with increasing Cu content. The amount of copper content in the nanocomposite films had also shown a significant reduction in the crystallite size of CrN. The nano hardness measurements showed a peak hardness of 17 GPa for the films with copper content of 15.1 at.%. The hardness values were found to decrease significantly with Cu content > 31.1 at.%.
研究了通过脉冲磁控溅射在(100)硅和D - 9合金衬底上沉积的CrN/Cu纳米复合薄膜的合成,该合成过程是铜含量在15.1 - 35.8原子百分比范围内的函数。对在773 K、氮气流量为10 sccm条件下沉积的薄膜进行X射线衍射分析表明,这些薄膜是纳米晶且为双相(面心立方结构的CrN和面心立方结构的Cu)。扫描电子显微镜显示CrN具有无结构的形态,而CrN/Cu纳米复合薄膜则形成了团聚体。原子力显微镜也证实了随着铜含量增加颗粒发生团聚。纳米复合薄膜中铜的含量还使CrN的晶粒尺寸显著减小。纳米硬度测量表明,铜含量为15.1原子百分比的薄膜峰值硬度为17 GPa。当铜含量> 31.1原子百分比时,硬度值显著下降。