Materials and Process Simulation Center, California Institute of Technology, Pasadena, California 91125 USA.
Nat Chem. 2009 Sep;1(6):482-6. doi: 10.1038/nchem.331.
The last decade has witnessed dramatic growth in the number of reactions catalyzed by electrophilic gold complexes. While proposed mechanisms often invoke the intermediacy of gold-stabilized cationic species, the nature of bonding in these intermediates remains unclear. Herein, we propose that the carbon-gold bond in these intermediates is comprised of varying degrees of both sigma and pi-bonding; however, the overall bond order is generally less than or equal to unity. The bonding in a given gold-stabilized intermediate, and the position of this intermediate on a continuum ranging from gold-stabilized singlet carbene to gold-coordinated carbocation, is dictated by the carbene substituents and the ancillary ligand. Experiments show that the correlation between bonding and reactivity is reflected in the yield of gold-catalyzed cyclopropanation reactions.
过去十年中,由亲电金配合物催化的反应数量显著增长。虽然提出的反应机制通常涉及金稳定的阳离子物种的中间体,但这些中间体的键合性质仍不清楚。在此,我们提出这些中间体中的碳-金键由不同程度的sigma 和 pi 键组成;然而,总的键级通常小于或等于 1。给定的金稳定中间体中的键合以及该中间体在从金稳定的单重态碳烯到金配位的碳正离子的连续体上的位置,由碳烯取代基和辅助配体决定。实验表明,键合与反应性之间的相关性反映在金催化的环丙烷化反应的产率上。