Ohya Kaoru, Inai Kensuke, Kawasaki Ryosuke, Saito Misako, Hayashi Teruyuki, Jau Jack, Kanai Kenichi
Institute of Technology and Science, The University of Tokushima, Minamijosanjima-cho, Tokushima, Japan.
J Electron Microsc (Tokyo). 2010 Aug;59 Suppl 1:S189-93. doi: 10.1093/jmicro/dfq047. Epub 2010 Jun 16.
A self-consistent simulation of secondary electron (SE) emission and charging of a SiO(2) layer with the thickness of several tens of nanometres on Si is incorporated into a trajectory simulation of emitted SEs above the surface, the centre area of which is charged by electron beams (EBs) at the energy range from 300 to 2000 eV. In order to study the influence of the charging of an insulating layer on defect inspection, a pseudo-image is reconstructed from net SE yields calculated at each point of the SiO(2) surface locally applied the positive voltage. The image contrast between charged and uncharged areas is compared with the observation of thermally oxidized layer with the thickness of 24-106 nm on a Si wafer. The image contrast is very sensitive to the thickness of the SiO(2) layer, which is verified by both observed and calculated images. The calculated changes of the images with the layer thickness and the primary electron energy reproduce the experimental observations fairly well. This confirms a highly sensitive detection mechanism for tiny defects in insulating patterns on a metal hard mask for an EB defect inspection equipment.
将对硅上厚度为几十纳米的SiO₂层的二次电子(SE)发射和充电进行的自洽模拟纳入到表面上方发射SE的轨迹模拟中,该表面中心区域由能量范围为300至2000 eV的电子束(EB)充电。为了研究绝缘层充电对缺陷检测的影响,根据在局部施加正电压的SiO₂表面各点计算出的净SE产率重建伪图像。将带电区域和不带电区域之间的图像对比度与硅晶片上厚度为24 - 106 nm的热氧化层的观察结果进行比较。图像对比度对SiO₂层的厚度非常敏感,这在观察图像和计算图像中都得到了验证。计算得到的图像随层厚度和一次电子能量的变化相当好地再现了实验观察结果。这证实了用于电子束缺陷检测设备的金属硬掩模上绝缘图案中微小缺陷的高灵敏度检测机制。