Schuettler Martin, Huegle Matthias, Ordonez Juan S, Wilde Juergen, Stieglitz Thomas
Laboratory for Biomedical Microtechnology, Dept. of Microsystems Engineering - IMTEK, University of Freiburg, Germany.
Annu Int Conf IEEE Eng Med Biol Soc. 2010;2010:1577-80. doi: 10.1109/IEMBS.2010.5626688.
Modern implanted devices utilize microelectronics that have to be protected from the body fluids in order to maintain their functionality over decades. Moisture protection of implants is addressed by enclosing the electronic circuits into gas-tight packages. In this paper we describe a device that allows custom-built hermetic implant packages to be vacuum-dried (removing residual moisture from inside the package), backfilled with an inert gas at adjustable pressure and hermetically sealed employing a solder seal. A typical operation procedure of the device is presented.
现代植入式设备使用的微电子元件必须免受体液影响，以便在数十年内保持其功能。通过将电子电路封装在气密包装中来解决植入物的防潮问题。在本文中，我们描述了一种设备，该设备允许定制的密封植入物包装进行真空干燥（去除包装内部的残留水分），以可调节的压力用惰性气体回填，并采用焊接密封进行气密密封。介绍了该设备的典型操作程序。
