Schuettler Martin, Ordonez Juan S, Silva Santisteban Tomas, Schatz Andreas, Wilde Juergen, Stieglitz Thomas
Laboratory for Biomedical Microtechnology, Dept. of Microsystems Engineering - IMTEK, University of Freiburg, Germany.
Annu Int Conf IEEE Eng Med Biol Soc. 2010;2010:1585-8. doi: 10.1109/IEMBS.2010.5626677.
A fabrication technology for small hermetic implant packages with large numbers of electrical feedthroughs is presented. First prototypes were fabricated on a ceramic substrate of 25·25 mm area, having a metal cup of 5 mm height soldered to it. These prototypes provide 360 feedthroughs. The electrical properties of the feedthroughs are characterized and the leakage rate of the packages is determined using helium fine leak tests. The amount of water sealed inside the packages is investigated. Based on maximum allowable water vapour concentrations inside hermetic packages reported in literature and applying a commonly accepted mathematical model, we predicted a minimum lifetime to water-induced failure of a few hundred years.
介绍了一种用于具有大量电馈通的小型密封植入式封装的制造技术。首批原型是在面积为25×25毫米的陶瓷基板上制造的，上面焊接有一个5毫米高的金属杯。这些原型提供360个馈通。对馈通的电学特性进行了表征，并使用氦气微泄漏测试确定了封装的泄漏率。研究了封装内部密封的水量。根据文献报道的密封封装内的最大允许水蒸气浓度，并应用一个普遍接受的数学模型，我们预测了由水引起的失效的最短寿命为几百年。
