Perera J R, Glasunov A V, Glaser V M, Boreiko A V
Department of Genetics and Selection, Moscow State University, USSR.
Mol Gen Genet. 1988 Aug;213(2-3):421-4. doi: 10.1007/BF00339611.
We studied the repair of double-strand breaks (DSB) in plasmid DNA introduced into haploid cells of the yeast Saccharomyces cerevisiae. The efficiency of repair was estimated from the frequency of transformation of the cells by an autonomously replicated linearized plasmid. The frequency of "lithium" transformation of Rad+ cells was increased greatly (by 1 order of magnitude and more) compared with that for circular DNA if the plasmid was initially linearized at the XhoI site within the LYS2 gene. This effect is due to recombinational repair of the plasmid DNA. Mutations rad52, rad53, rad54 and rad57 suppress the repair of DSB in plasmid DNA. The kinetics of DSB repair in plasmid DNA are biphasic: the first phase is completed within 1 h and the second within 14-18 h of incubating cells on selective medium.
我们研究了导入酿酒酵母单倍体细胞的质粒DNA中双链断裂(DSB)的修复情况。通过自主复制的线性化质粒对细胞进行转化的频率来估算修复效率。如果质粒最初在LYS2基因内的XhoI位点处线性化,那么与环状DNA相比,Rad+细胞的“锂”转化频率会大幅增加(增加1个数量级及以上)。这种效应归因于质粒DNA的重组修复。rad52、rad53、rad54和rad57突变会抑制质粒DNA中DSB的修复。质粒DNA中DSB修复的动力学是双相的:在选择性培养基上培养细胞的1小时内完成第一阶段,14 - 18小时内完成第二阶段。