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电化学无标记免疫传感器用于表皮生长因子受体 (EGFR) 的检测。

Electrochemical immunosensor for label free epidermal growth factor receptor (EGFR) detection.

机构信息

Bio-MEMS and Microsystems Lab, Department of Biomedical Engineering, Florida International University, Miami, FL 33174, USA.

出版信息

Biosens Bioelectron. 2013 Jan 15;39(1):300-5. doi: 10.1016/j.bios.2012.06.012. Epub 2012 Jun 28.

Abstract

This paper presents an electrochemical immune sensor for label free detection of epidermal growth factor receptor (EGFR) by immobilizing anti-EGFR antibody (Anti-EGFRab) on dithiobissuccinimidyl propionate (DTSP) self-assembled monolayer (SAM) on gold (Au) electrode. Electrochemical studies show that increased surface concentration of redox moieties onto Anti-EGFRab/DTSP immuno-electrode leads to high electron transport and improved sensing performance. The antigen-antibody complex demonstrates a high association constant (5×10(12)L/mol) that results in high affinity of Anti-EGFRab to EGFR, confirming that the DTSP-SAM provides a conducive environment for anti-EGFR immobilization. The electrochemical response of EA/Anti-EGFRab/DTSP/Au electrode as a function of EGFR concentrations exhibits a linear range from 1pg/mL to 100ng/mL, a detection limit of 1pg/mL at a sensitivity of 2.02μA M(-1)at a regression coefficient of 0.99.

摘要

本文提出了一种电化学免疫传感器,用于通过将抗表皮生长因子受体(EGFR)抗体(Anti-EGFRab)固定在金(Au)电极上的二硫代双琥珀酰亚胺丙酸(DTSP)自组装单层(SAM)上来对 EGFR 进行无标记检测。电化学研究表明,增加到 Anti-EGFRab/DTSP 免疫电极上的氧化还原部分的表面浓度导致高电子传输和改进的传感性能。抗原 - 抗体复合物表现出高缔合常数(5×10(12)L/mol),这导致 Anti-EGFRab 与 EGFR 的高亲和力,证实 DTSP-SAM 为 Anti-EGFR 的固定提供了有利的环境。EA/Anti-EGFRab/DTSP/Au 电极的电化学响应作为 EGFR 浓度的函数表现出从 1pg/mL 到 100ng/mL 的线性范围,在灵敏度为 2.02μA M(-1)时检测限为 1pg/mL,回归系数为 0.99。

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