Holler M, Raabe J, Diaz A, Guizar-Sicairos M, Quitmann C, Menzel A, Bunk O
Paul Scherrer Institut, 5232 Villigen PSI, Switzerland.
Rev Sci Instrum. 2012 Jul;83(7):073703. doi: 10.1063/1.4737624.
We present an instrument dedicated to 3D scanning x-ray microscopy, allowing a sample to be precisely scanned through a beam while the angle of x-ray incidence can be changed. The position of the sample is controlled with respect to the beam-defining optics by laser interferometry. The instrument achieves a position stability better than 10 nm standard deviation. The instrument performance is assessed using scanning x-ray diffraction microscopy and we demonstrate a resolution of 18 nm in 2D imaging of a lithographic test pattern while the beam was defined by a pinhole of 3 μm in diameter. In 3D on a test object of copper interconnects of a microprocessor, a resolution of 53 nm is achieved.
我们展示了一种专门用于三维扫描X射线显微镜的仪器，它能在改变X射线入射角的同时，使样品在光束中进行精确扫描。样品相对于光束限定光学元件的位置通过激光干涉测量法进行控制。该仪器实现了优于10纳米标准偏差的位置稳定性。使用扫描X射线衍射显微镜对仪器性能进行了评估，我们证明在直径为3微米的针孔定义光束时，光刻测试图案的二维成像分辨率为18纳米。在微处理器铜互连测试对象的三维成像中，实现了53纳米的分辨率。
