Siyuan Laboratory, Department of Physics, Jinan University, Guangzhou, Guangdong 510632, People's Republic of China.
ACS Appl Mater Interfaces. 2013 Jun 12;5(11):4960-5. doi: 10.1021/am4006447. Epub 2013 May 22.
The interfacial transport properties and density of states (DOS) of CuPc near the dielectric surface in an operating organic field-effect transistor (OFET) are investigated using Kelvin probe force microscopy. We find that the carrier mobility of CuPc on high-k Al2Oy/TiOx (ATO) dielectrics under a channel electrical field of 4.3 × 10(2) V/cm reaches 20 times as large as that of CuPc on SiO2. The DOS of the highest occupied molecular orbital (HOMO) of CuPc on the ATO substrate has a Gaussian width of 0.33 ± 0.02 eV, and the traps DOS in the gap of CuPc on the ATO substrate is as small as 7 × 10(17) cm(-3). A gap state near the HOMO edge is observed and assigned to the doping level of oxygen. The measured HOMO DOS of CuPc on SiO2 decreases abruptly near E(V(GS) = V(T)), and the pinning of DOS is observed, suggesting a higher trap DOS of 10(19)-10(20) cm(-3) at the interface. The relationships between DOS and the structural, chemical, as well as electrical properties at the interface are discussed. The superior performance of CuPc/ATO OFET is attributed to the low trap DOS and doping effect.
利用 Kelvin 探针力显微镜研究了工作有机场效应晶体管(OFET)中介质表面附近酞菁铜的界面输运性质和态密度(DOS)。我们发现,在 4.3×10(2) V/cm 的沟道电场下,高介电常数 Al2Oy/TiOx(ATO)电介质上的酞菁铜的载流子迁移率达到了在 SiO2 上的 20 倍。ATO 衬底上酞菁铜的最高占据分子轨道(HOMO)的 DOS 具有 0.33±0.02 eV 的高斯宽度,而 ATO 衬底上酞菁铜的间隙 DOS 小至 7×10(17) cm(-3)。观察到 HOMO 边缘附近存在一个间隙态,并将其归因于氧的掺杂水平。在 E(V(GS)=V(T))附近,SiO2 上的酞菁铜的 HOMO DOS 急剧下降,并且观察到 DOS 的钉扎,表明界面处的陷阱 DOS 高达 10(19)-10(20) cm(-3)。讨论了 DOS 与界面处的结构、化学和电学性质之间的关系。酞菁铜/ATO OFET 的优异性能归因于低陷阱 DOS 和掺杂效应。