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基于新型结构非晶态氟聚合物的无孔低介电常数薄膜。

Non-porous low-k dielectric films based on a new structural amorphous fluoropolymer.

机构信息

Key Laboratory of Organofluorine Chemistry and Laboratory for Polymer Materials, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences, 345 Lingling Road, Shanghai 200032, P.R. China.

出版信息

Adv Mater. 2013 Sep 20;25(35):4875-8. doi: 10.1002/adma.201302021. Epub 2013 Jul 15.

DOI:10.1002/adma.201302021
PMID:23857724
Abstract

A non-porous and amorphous fluoropolymer PFN with low dielectric constant of 2.33 and dielectric loss less than 1.2 × 10(-3) is reported here. PFN also exhibits good mechanical properties and high thermostability. This study is a new example of a fully dense material showing a low k value and having good thermo/mechanical properties.

摘要

本文报道了一种具有低介电常数 2.33 和介电损耗小于 1.2×10(-3)的无孔非晶态氟聚合物 PFN。PFN 还具有良好的机械性能和高热稳定性。本研究为具有低 k 值和良好热/机械性能的全致密材料提供了新的范例。

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