Chinnam Krishna Chytanya, Gleskova Helena
Department of Electronic and Electrical Engineering, University of Strathclyde, 204 George Street, Glasgow G1 1XW, United Kingdom.
J Nanosci Nanotechnol. 2013 Jul;13(7):5182-5. doi: 10.1166/jnn.2013.7510.
Effect of heat treatment in aluminium oxide (AlO(x)) preparation employing UV/ozone exposure of thermally-evaporated aluminium is reported. AlO(x) is combined with 1-octylphosphonic acid to form a gate dielectric in low-voltage organic thin-film transistors based on pentacene. For short UV/ozone exposure times the 100 degrees C-heating step that immediately follows UV/ozone oxidation of aluminium leads to a decrease in the transistor threshold voltage of up to 8% and - fourfold reduction in the gate dielectric current density. Transistors with AlO(x) prepared by 60-minute UV/ozone oxidation do not exhibit such behaviour. These results are explained in terms of reduced density of charged oxygen vacancies in the UV/ozone oxidized AlO(x).
报道了在采用热蒸发铝的紫外/臭氧暴露制备氧化铝(AlO(x))过程中热处理的影响。AlO(x)与1-辛基膦酸结合,在基于并五苯的低压有机薄膜晶体管中形成栅极电介质。对于短的紫外/臭氧暴露时间,铝的紫外/臭氧氧化之后紧接着的100℃加热步骤会导致晶体管阈值电压降低高达8%,并且栅极电介质电流密度降低四倍。通过60分钟紫外/臭氧氧化制备的具有AlO(x)的晶体管没有表现出这种行为。这些结果是根据紫外/臭氧氧化的AlO(x)中带电氧空位密度的降低来解释的。