Xing Yun, Li Alex, Felker Daniel L, Burggraf Larry W
Department of Engineering Physics, Air Force Institute of Technology, Wright-Patterson Air Force Base (WPAFB), Dayton, Ohio, USA.
Appl Environ Microbiol. 2014 Mar;80(5):1739-49. doi: 10.1128/AEM.03483-13. Epub 2013 Dec 27.
Effective killing of Bacillus anthracis spores is of paramount importance to antibioterrorism, food safety, environmental protection, and the medical device industry. Thus, a deeper understanding of the mechanisms of spore resistance and inactivation is highly desired for developing new strategies or improving the known methods for spore destruction. Previous studies have shown that spore inactivation mechanisms differ considerably depending upon the killing agents, such as heat (wet heat, dry heat), UV, ionizing radiation, and chemicals. It is believed that wet heat kills spores by inactivating critical enzymes, while dry heat kills spores by damaging their DNA. Many studies have focused on the biochemical aspects of spore inactivation by dry heat; few have investigated structural damages and changes in spore mechanical properties. In this study, we have inactivated Bacillus anthracis spores with rapid dry heating and performed nanoscale topographical and mechanical analysis of inactivated spores using atomic force microscopy (AFM). Our results revealed significant changes in spore morphology and nanomechanical properties after heat inactivation. In addition, we also found that these changes were different under different heating conditions that produced similar inactivation probabilities (high temperature for short exposure time versus low temperature for long exposure time). We attributed the differences to the differential thermal and mechanical stresses in the spore. The buildup of internal thermal and mechanical stresses may become prominent only in ultrafast, high-temperature heat inactivation when the experimental timescale is too short for heat-generated vapor to efficiently escape from the spore. Our results thus provide direct, visual evidences of the importance of thermal stresses and heat and mass transfer to spore inactivation by very rapid dry heating.
有效杀灭炭疽芽孢杆菌孢子对于抗生物恐怖主义、食品安全、环境保护以及医疗器械行业至关重要。因此,深入了解孢子抗性和失活机制对于开发新策略或改进已知的孢子破坏方法非常必要。先前的研究表明,孢子失活机制因杀灭剂不同而有很大差异,如热(湿热、干热)、紫外线、电离辐射和化学物质。据信,湿热通过使关键酶失活来杀死孢子,而干热则通过破坏孢子的DNA来杀死孢子。许多研究集中在干热使孢子失活的生化方面;很少有研究调查孢子失活后的结构损伤和机械性能变化。在本研究中,我们通过快速干热使炭疽芽孢杆菌孢子失活,并使用原子力显微镜(AFM)对失活的孢子进行纳米级形貌和力学分析。我们的结果显示,热失活后孢子形态和纳米力学性能发生了显著变化。此外,我们还发现,在产生相似失活概率的不同加热条件下(短暴露时间的高温与长暴露时间的低温),这些变化是不同的。我们将这些差异归因于孢子内不同的热应力和机械应力。只有在超快、高温热失活过程中,当实验时间尺度过短,热产生的蒸汽无法有效从孢子中逸出时,内部热应力和机械应力的积累才可能变得显著。因此,我们的结果提供了直接的视觉证据,证明热应力以及热质传递对于通过非常快速的干热使孢子失活的重要性。