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通过形成电偶极子和费米能级钉扎,Au 催化剂/GaAs 纳米线界面处的肖特基势垒大幅降低。

Strong Schottky barrier reduction at Au-catalyst/GaAs-nanowire interfaces by electric dipole formation and Fermi-level unpinning.

机构信息

Division of Solid State Physics and The Nanometer Structure Consortium (nmC@LU), Lund University, Box 118, SE-221 00 Lund, Sweden.

1] Division of Solid State Physics and The Nanometer Structure Consortium (nmC@LU), Lund University, Box 118, SE-221 00 Lund, Sweden [2] Department of Mathematics, Physics and Electrical Engineering, Halmstad University, Box 823, SE-301 18 Halmstad, Sweden.

出版信息

Nat Commun. 2014;5:3221. doi: 10.1038/ncomms4221.

DOI:10.1038/ncomms4221
PMID:24488034
Abstract

Nanoscale contacts between metals and semiconductors are critical for further downscaling of electronic and optoelectronic devices. However, realizing nanocontacts poses significant challenges since conventional approaches to achieve ohmic contacts through Schottky barrier suppression are often inadequate. Here we report the realization and characterization of low n-type Schottky barriers (0.35 eV) formed at epitaxial contacts between Au-In alloy catalytic particles and GaAs-nanowires. In comparison to previous studies, our detailed characterization, employing selective electrical contacts defined by high-precision electron beam lithography, reveals the barrier to occur directly and solely at the abrupt interface between the catalyst and nanowire. We attribute this lowest-to-date-reported Schottky barrier to a reduced density of pinning states (10(17) m(-2)) and the formation of an electric dipole layer at the epitaxial contacts. The insight into the physical mechanisms behind the observed low-energy Schottky barrier may guide future efforts to engineer abrupt nanoscale electrical contacts with tailored electrical properties.

摘要

金属和半导体之间的纳米接触对于进一步缩小电子和光电子器件的尺寸至关重要。然而,实现纳米接触存在重大挑战,因为通过抑制肖特基势垒来实现欧姆接触的传统方法往往不够。在这里,我们报告了在 Au-In 合金催化颗粒和 GaAs 纳米线之间的外延接触处形成的低 n 型肖特基势垒(0.35 eV)的实现和特性。与以前的研究相比,我们通过使用高精度电子束光刻定义的选择性电接触进行的详细特性分析表明,势垒直接且仅在催化剂和纳米线之间的突然界面处发生。我们将这种迄今为止报道的最低肖特基势垒归因于钉扎态密度的降低(10^17 m^(-2)) 和在外延接触处形成电偶极层。对观察到的低能肖特基势垒背后的物理机制的深入了解可能会指导未来的工程努力,以实现具有定制电性能的急变纳米尺度电接触。

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