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研究氢化等离子体处理减少非晶硅碳化硅矩阵硅量子点超晶格结构中的缺陷。

Investigation of hydrogen plasma treatment for reducing defects in silicon quantum dot superlattice structure with amorphous silicon carbide matrix.

机构信息

Department of Physical Electronics, Tokyo Institute of Technology, Meguro-ku, Tokyo 152-8552, Japan.

出版信息

Nanoscale Res Lett. 2014 Feb 12;9(1):72. doi: 10.1186/1556-276X-9-72.

Abstract

We investigate the effects of hydrogen plasma treatment (HPT) on the properties of silicon quantum dot superlattice films. Hydrogen introduced in the films efficiently passivates silicon and carbon dangling bonds at a treatment temperature of approximately 400°C. The total dangling bond density decreases from 1.1 × 1019 cm-3 to 3.7 × 1017 cm-3, which is comparable to the defect density of typical hydrogenated amorphous silicon carbide films. A damaged layer is found to form on the surface by HPT; this layer can be easily removed by reactive ion etching.

摘要

我们研究了氢等离子体处理(HPT)对硅量子点超晶格薄膜性能的影响。在处理温度约为 400°C 的情况下,氢有效地使硅和碳悬挂键钝化。总悬挂键密度从 1.1×1019cm-3降低到 3.7×1017cm-3,与典型氢化非晶硅碳化硅薄膜的缺陷密度相当。通过 HPT 在表面形成了一层损伤层;通过反应离子刻蚀可以很容易地去除这层。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d2e3/3926976/a7d8ec2f981a/1556-276X-9-72-1.jpg

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