Department of Physical Electronics, Tokyo Institute of Technology, Meguro-ku, Tokyo 152-8552, Japan.
Nanoscale Res Lett. 2014 Feb 12;9(1):72. doi: 10.1186/1556-276X-9-72.
We investigate the effects of hydrogen plasma treatment (HPT) on the properties of silicon quantum dot superlattice films. Hydrogen introduced in the films efficiently passivates silicon and carbon dangling bonds at a treatment temperature of approximately 400°C. The total dangling bond density decreases from 1.1 × 1019 cm-3 to 3.7 × 1017 cm-3, which is comparable to the defect density of typical hydrogenated amorphous silicon carbide films. A damaged layer is found to form on the surface by HPT; this layer can be easily removed by reactive ion etching.
我们研究了氢等离子体处理(HPT)对硅量子点超晶格薄膜性能的影响。在处理温度约为 400°C 的情况下,氢有效地使硅和碳悬挂键钝化。总悬挂键密度从 1.1×1019cm-3降低到 3.7×1017cm-3,与典型氢化非晶硅碳化硅薄膜的缺陷密度相当。通过 HPT 在表面形成了一层损伤层;通过反应离子刻蚀可以很容易地去除这层。